Composite Molding with Solvent-Free Conductive Bonding
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Solution Overview
Problem
Conventional outsert molding methods for connecting contact pins with electrode patterns face issues such as solvent volatility, base film damage, and unstable electrical conductivity, particularly when using flat pins and requiring narrow insertion holes.
Innovation Solution
A composite molding configuration where an insulative molded body with an embedded contact pin and an electrode pattern layer is bonded using a small quantity of electrically conductive bonding agent, with the contact pin's end piercing through a base film or transfer layer, ensuring reliable electrical connection and preventing external appearance defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a paste-like electrically conductive bonding agent including a solvent is injected into the insertion hole before inserting the contact pin, then electrical connection can be made reliably, but the solvent does not volatilize, taking time for the bonding agent to dry and harden, and the base film dissolves or swells leading to abnormal external appearance
Solution Approach 1:
The patent extracts the harmful solvent component from the bonding agent system by using a solvent-free electrically conductive bonding agent. This eliminates the base film dissolution and swelling problems while maintaining electrical connection reliability through the solvent-free formulation that cures without causing external appearance defects.
Solution Approach 2:
The patent changes the chemical composition parameters of the bonding agent by transitioning from a solvent-based paste to a solvent-free formulation. This parameter change eliminates the harmful effects of solvent volatilization and base film interaction while achieving reliable electrical conductivity through alternative curing mechanisms.
2Stability of the object's composition
If the insertion hole diameter is made narrower than the diameter of the contact pin to ensure the contact pin is not unsteady, then the contact pin stability is improved, but a sufficient effect is not obtained and electrical conductivity is unstable even if the pin is ultrasonically inserted
Solution Approach 1:
The patent introduces an electrically conductive bonding agent as an intermediary substance between the contact pin and the electrode pattern layer. This bonding agent fills the interface gap, providing both mechanical stability for the contact pin and reliable electrical conductivity, resolving the contradiction between narrow hole stability and electrical connection quality.
3Adaptability or versatility
If a flat pin is used as the contact pin, then the design flexibility is improved, but the flat pin cannot be used because the insertion hole is narrow and therefore the electrically conductive bonding agent cannot be injected
Solution Approach 1:
The patent applies the electrically conductive bonding agent to the electrode pattern layer or insertion hole before inserting the flat contact pin. This preliminary action ensures that the bonding agent is in position to fill the interface when the flat pin is inserted, enabling both flat pin design flexibility and successful bonding agent application without requiring post-insertion injection.
4Reliability
If a large quantity of electrically conductive bonding agent is used to ensure reliable electrical connection, then electrical conductivity is improved, but the base film dissolves or swells by the action of the solvent, leading to an abnormal external appearance
Solution Approach 1:
The patent removes the solvent component from the bonding agent formulation, using a solvent-free electrically conductive bonding agent instead. This extraction of the harmful solvent allows sufficient bonding agent quantity to be used for reliable electrical connection without causing base film dissolution or swelling that would result in abnormal external appearance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable electrical connection between the contact pin and electrode pattern while minimizing the adverse effects of the bonding agent, ensuring stability and preventing damage to the base film or transfer layer, thus enhancing the composite molding's reliability and appearance.
Implementation Method 1
an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin, thereby forming an electrical connection
Implementation Method 2
an other end of which pierces through the base film and is exposed
Data Source
AI summary
A composite molding comprises an insulative molded body molded into a prescribed shape; an insulative transfer layer covering at least part of a front surface of the molded body; an electrode pattern layer formed between the molded body and the transfer layer; an electrically conductive contact pin having one end side buried in the molded body and fixed thereto and an other end stuck out from the molded body; and an electrically conductive bonding agent formed between the electrode pattern layer and the molded body and bonding to the electrode pattern layer and the contact pin to form an electrical connection between the electrode pattern layer and the contact pin. This arrangement prevents defects caused by embedding a contact pin in a molded body and reliably makes an electrical connection between the contact pin and an electrode pattern layer.