Composite Molding Die Laminate for Faster Cooling and Smooth Cavities
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Solution Overview
Problem
Molding dies made of resin have low thermal conductivity, leading to slow cooling and potential warping of molded products, while those made of metal cause filling failures due to rapid hardening of materials.
Innovation Solution
A molding die is manufactured using a laminate composed of metal particles and resin, with an average particle diameter D50 of the metal particles being less than or equal to 23 μm, to balance thermal conductivity and prevent filling failures and warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a molding die is made of resin, then it is easy to manufacture and inexpensive, but thermal conductivity is low causing slow cooling and heat retention
Solution Approach 1:
The patent applies composite materials by combining metal particles (providing thermal conductivity) with resin (providing ease of manufacture and flexibility). This creates a molding die that achieves both easy manufacturing and improved cooling performance through the synergistic properties of the composite structure.
2Temperature
If a molding die is made of metal, then thermal conductivity is high enabling fast cooling, but material hardens too quickly causing filling failures
Solution Approach 1:
The composite material structure allows control over cooling speed by adjusting metal particle concentration and size. The resin matrix moderates the thermal conductivity, preventing excessive heat transfer that would cause premature hardening, while still providing faster cooling than pure resin.
Solution Approach 2:
The patent changes physical parameters including metal particle size (D50 ≤ 23 μm), particle concentration (5-60 vol%), and particle shape to optimize the balance between cooling speed and filling success. These parameter adjustments fine-tune the thermal properties to prevent both overheating and excessive cooling.
3Temperature
If metal particles with large diameter are used in laminate, then thermal conductivity improves, but surface roughness increases causing poor molding quality
Solution Approach 1:
The patent specifies precise parameter ranges for metal particles, particularly size (D50 ≤ 23 μm) and distribution. This parameter optimization ensures sufficient thermal conductivity while maintaining smooth cavity surfaces for high-quality molding. The controlled particle size prevents surface irregularities that would otherwise transfer to the molded product.
Solution Approach 2:
The patent applies local quality by controlling metal particle distribution within the laminate. Smaller particles are used in regions where surface smoothness is critical, while maintaining adequate thermal conductivity through proper concentration and distribution patterns throughout the molding die structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces heat retention in the laminate, shortening cooling time and preventing filling failures and warping, while maintaining a smooth cavity surface for high-quality product production.
Implementation Method 1
A molding die made of resin, however, has low thermal conductivity, so that heat builds up in the molding die
Data Source
AI summary
A method for manufacturing a molding die used with an injection molder, the method including plasticizing a creating material containing metal particles and resin to produce a plasticized material, and dispensing the plasticized material toward a stage to stack layers on each other to create a laminate that forms at least a portion of the molding die, with an average particle diameter D50 of the metal particles being smaller than or equal to 23 μm.