Composite Molding Structure for Low-Profile Semiconductor Heat Dissipation
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high-performance, compact, and reliable semiconductor packages with efficient thermal management and reduced height, particularly in package-on-package (PoP) configurations where existing solutions fail to effectively integrate multiple semiconductor chips with varying functions on a smaller area.
Innovation Solution
A semiconductor package design featuring a lower semiconductor chip mounted on a substrate with an interposer and multiple molding members, where a high-thermal-conductivity first molding member covers the chip and interposer, and a lower-thermal-conductivity second molding member surrounds the connection terminals and edges, reducing thermal resistance while maintaining mechanical rigidity and preventing electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single molding material is used to cover the semiconductor chip and interposer, then the manufacturing process is simplified, but thermal management performance deteriorates due to insufficient heat dissipation
Solution Approach 1:
The molding structure is divided into two distinct members: a first molding member covering the semiconductor chip with high thermal conductivity material for heat dissipation, and a second molding member covering the interposer with low thermal conductivity material for insulation. This segmentation allows each region to be optimized for its specific thermal requirements.
Solution Approach 2:
Different regions of the package are assigned different thermal properties: the region around the semiconductor chip uses high thermal conductivity material to conduct heat away, while the region around the interposer uses low thermal conductivity material to prevent heat transfer. This local quality optimization resolves the thermal management contradiction.
2Length of stationary object
If the overall height of the package is reduced for compactness, then the form factor is improved, but the thermal dissipation capability deteriorates due to reduced space for heat sinks and cooling structures
Solution Approach 1:
The patent transitions from vertical heat dissipation (requiring height) to lateral heat dissipation by placing high thermal conductivity molding material directly around the chip in the horizontal plane. This allows efficient heat conduction without increasing package height, resolving the contradiction between compactness and thermal capability.
3Temperature
If multiple molding members with different materials are used to optimize thermal management, then thermal performance is improved, but the device complexity increases
Solution Approach 1:
The molding structure is segmented into two functional members with different thermal properties, allowing optimized thermal management while maintaining a relatively simple overall structure that integrates seamlessly with the package components.
Solution Approach 2:
The first molding member serves dual functions: it provides mechanical protection for the semiconductor chip and simultaneously acts as a thermal conduction path due to its high thermal conductivity material. This multi-functionality reduces the need for additional dedicated heat sinking components, offsetting the complexity increase.
4Productivity
If the semiconductor package integrates multiple chips with varying functions on a smaller area, then the productivity and density are improved, but the reliability deteriorates due to increased thermal stress and heat accumulation
Solution Approach 1:
Each chip region is provided with molding material having thermal conductivity tailored to that specific chip's heat generation characteristics. High-power chips receive high thermal conductivity material, while low-power chips receive lower thermal conductivity material, optimizing thermal management for each component and reducing thermal stress.
Solution Approach 2:
The molding structure is segmented to provide independent thermal management zones for each integrated chip, allowing heat from multiple chips to be dissipated through dedicated pathways rather than accumulating, thereby maintaining reliability in high-density configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal management by reducing thermal resistance and mechanical rigidity, improving the reliability and compactness of semiconductor packages, allowing for efficient heat dissipation and integration of multiple semiconductor chips in a smaller form factor.
Implementation Method 1
a first molding member including a first material and covering at least a portion of a top surface of the lower semiconductor chip... wherein the first material has thermal conductivity greater than thermal conductivity of the second material
Data Source
AI summary
A semiconductor package includes; a lower semiconductor chip mounted on a lower package substrate, an interposer on the lower package substrate and including an opening, connection terminals spaced apart from and at least partially surrounding the lower semiconductor chip and extending between the lower package substrate and the interposer, a first molding member including a first material and covering at least a portion of a top surface of the lower semiconductor chip and at least portions of edge surfaces of the lower semiconductor chip, wherein the first molding member includes a protrusion that extends upward from the opening to cover at least portions of a top surface of the interposer proximate to the opening, and a second molding member including a second material, at least partially surrounding the first molding member, and covering side surfaces of the first molding member and the connection terminals, wherein the first material has thermal conductivity greater than the second material.