Composite Package Structure for 3D IC Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in managing heat dissipation in advanced IC packaging due to increasing power density, as traditional thermal management materials lack sufficient thermal conductivity and mechanical properties for dense electronic components.
Innovation Solution
A composite material is formed by premixing cellulose nanofibrils (CNFs) and thermally conductive 2D materials like hexagonal boron nitride (h-BN) or graphene with a polymeric material, creating a compact thermal network through a specific processing method that includes filtration, drying, and injection molding, enhancing thermal conductivity and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal management materials are used, then the packaging structure can be manufactured with standard materials, but the thermal conductivity is insufficient for high power density applications
Solution Approach 1:
The patent uses composite materials consisting of thermally conductive filler particles (such as aluminum oxide, aluminum nitride, or boron nitride) dispersed within a polymeric matrix material. This composite structure achieves high thermal conductivity while maintaining the ease of manufacturing associated with standard polymeric materials, resolving the contradiction between thermal performance and manufacturability.
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the packaging material by controlling the concentration, size distribution, and morphology of the thermally conductive filler particles. By optimizing these parameters, the material achieves sufficient thermal conductivity for high power density applications while maintaining processability through standard manufacturing techniques.
2Productivity
If denser electronic components are integrated, then more components can be placed in a given area, but heat dissipation becomes more difficult
Solution Approach 1:
The patent employs composite materials with high thermal conductivity fillers embedded in a polymeric matrix to create packaging structures that can effectively dissipate heat from densely integrated electronic components. The composite structure provides both the mechanical properties needed for high-density packaging and the thermal conductivity required for heat management.
Solution Approach 2:
The patent applies thermally conductive composite materials specifically in regions where heat dissipation is critical, such as near high-power components or in thermal pathways, while using standard materials in other regions. This localized application of high-performance materials optimizes heat dissipation without requiring the entire packaging structure to be made from complex high-conductivity materials.
3Temperature
If higher filler weight ratio of thermally conductive materials is used, then thermal conductivity improves, but dielectric constant and tangent loss increase
Solution Approach 1:
The patent optimizes the filler weight ratio to achieve a balance between thermal conductivity and dielectric properties. By carefully controlling the concentration of thermally conductive filler particles and selecting fillers with appropriate dielectric characteristics, the material achieves sufficient thermal management performance while maintaining acceptable dielectric constants and tangent loss for high-speed computing applications.
Solution Approach 2:
The patent uses composite materials with carefully selected filler particles that provide both thermal conductivity and acceptable dielectric properties. The polymeric matrix material is chosen to complement the filler properties, creating a composite that achieves the desired thermal performance without excessive dielectric loss, resolving the trade-off between thermal and dielectric characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting composite material exhibits improved thermal conductivity and mechanical properties, effectively managing heat dissipation in 3D electronic applications while maintaining low dielectric constants and tangent loss, suitable for high-speed computing and shielding against electromagnetic interference.
Implementation Method 1
The first 2D material has an in-plane thermal conductivity greater than a thermal conductivity of the first polymeric material
Data Source
AI summary
A method for fabricating a package structure is provided. The method includes premixing cellulose nanofibrils (CNFs) and a two-dimensional (2D) material in a solvent to form a solution; removing the solvent from the solution to form a composite filler; mixing a prepolymeric material with the composite filler to form a composite material; and performing a molding process using the composite material.