Composite Packaging Material for Power Storage Devices

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Solution Overview

Problem

Existing packaging materials for power storage devices face challenges in achieving thinness and weight reduction while maintaining formability and mechanical strength, especially during deep forming processes, which often result in cracks and limited impact resistance.

Innovation Solution

A packaging material comprising a polyamide resin layer as the outer layer, a polyolefin resin layer as the inner layer, and an aluminum foil layer in between, with specific thickness ratios and properties to achieve high tensile breaking strength, elongation, and fracture strain energy, enabling deep shape forming and improved impact resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If the thickness of the packaging material is reduced to achieve thinning and weight saving, then weight and thickness are improved, but cracks occur during deep forming and mechanical strength deteriorates

Engineering Contradiction:
Improveweight of packaging materialVSAvoidmechanical strength and formability
Core Design Contradiction:
Weight of moving objectVSStrength

Solution Approach 1:

The packaging material uses a five-layer composite structure consisting of polyamide resin layer, aluminum foil layer, polyolefin resin layer, adhesive layers, and heat resistant resin layer. This composite structure combines the high strength and formability of polyamide, the barrier properties of aluminum foil, and the heat resistance of heat resistant resin, achieving both thinness and mechanical strength simultaneously

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent specifies precise thickness parameters for each layer (polyamide: 10-30 μm, aluminum foil: 10-20 μm, polyolefin: 10-30 μm, heat resistant resin: 10-30 μm) to optimize the balance between overall thickness reduction and maintaining sufficient mechanical strength for deep forming operations

Inventive Principle:
Principle #35Parameter changes

2Length of stationary object

If the thickness of the packaging material is reduced to achieve thinning, then thickness is improved, but cracks occur during deep forming and formability deteriorates

Engineering Contradiction:
Improvethickness of packaging materialVSAvoidformability during deep forming
Core Design Contradiction:
Length of stationary objectVSEase of manufacture

Solution Approach 1:

The polyamide resin layer provides excellent formability and deep drawing characteristics, while the heat resistant resin layer maintains structural integrity during forming. This composite approach enables deep forming at reduced thickness without crack formation

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

By controlling the polyamide resin layer thickness to 10-30 μm and heat resistant resin layer to 10-30 μm, the material achieves optimal balance between thinness and formability, allowing deep forming processes to complete successfully without defects

Inventive Principle:
Principle #35Parameter changes

3Weight of moving object

If the thickness of the packaging material is reduced to achieve weight saving, then weight is improved, but impact resistance deteriorates

Engineering Contradiction:
Improveweight of packaging materialVSAvoidimpact resistance
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The aluminum foil layer provides high tensile strength and impact resistance, while the polyamide and heat resistant resin layers provide toughness and energy absorption. This multi-material composite achieves superior impact resistance at reduced overall thickness and weight

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The optimized thickness distribution (aluminum foil: 10-20 μm, polyamide: 10-30 μm, heat resistant resin: 10-30 μm) ensures sufficient impact resistance while minimizing overall weight, with the total thickness controlled to achieve weight savings

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10243178B2Packaging material for power storage device, and power storage device
Publication Date: 2019.03.26 SHOWA DENKO PACKAGING CO LTD
  • US10243178B2 patent drawing
  • US10243178B2 patent drawing
  • US10243178B2 patent drawing

AI summary

A packaging material 1 for a power storage device is configured to include a polyamide resin layer 2 as an outer layer, a polyolefin resin layer 3 as an inner layer, and an aluminum foil layer 4 arranged between both the layers. A thickness of the packaging material 1 for a power storage device is 90 μm or less, a tensile breaking strength of the packaging material for a power storage device is 110 N/15 mm width or more, and a tensile breaking elongation of the packaging material for a power storage device is 90% or more. This enables to provide a packaging material for a power storage device thin in thickness and light in weight which is capable of securing excellent formability even when deep shape forming is performed and also is high in mechanical strength and excellent in impact resistance.