Composite Pane Recesses for LED Stress and Optical Quality

The patent applies local quality by creating a recess in the thermoplastic intermediate layer at the specific location where the light-emitting diode is arranged. This recess locally modifies the intermediate layer's structure to accommodate the electronic component, allowing the rest of the intermediate layer to maintain its stress-compensating function while the localized area provides thickness compensation for the LED.

The recess is formed in the thermoplastic intermediate layer before the lamination process, during the preparation stage. This preliminary action ensures that when the light-emitting diode is subsequently arranged in the recess, it is already positioned at the correct depth and orientation, preventing stress generation during the lamination process and enabling the use of thicker components.

Instead of creating complete openings (perforations) in the plastic film, the patent creates recesses that remove only a portion of the film material. This local modification maintains the film's continuity and structural integrity while providing sufficient space for the light-emitting diode, thereby preventing bubble formation and maintaining high optical quality.

The patent uses a thermoplastic intermediate layer with specific material properties (polyvinyl butyral, ethylene vinyl acetate, polyacrylate, polymethyl methacrylate, or polyurethane) that can be locally recessed while maintaining overall film integrity. The thermoplastic material's properties allow it to be shaped into recesses that accommodate LEDs without creating defects, combining the benefits of thickness accommodation with optical quality preservation.