Composite Panel for Thermal Conduction in Electronic Assemblies
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Solution Overview
Problem
Circuit board assemblies face challenges in effectively managing heat dissipation and physical stiffness while maintaining a reasonable weight, limiting the use of larger circuit boards.
Innovation Solution
A composite heat frame is introduced, comprising a panel and a support structure with walls that enclose a space, where the panel has sections with high thermal conductivity parallel to its inner surface and significantly lower conductivity perpendicular to it, enhancing both heat conduction and physical stiffness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional support structures are used to enhance heat sinking and physical stiffness, then thermal management and structural strength improve, but weight increases significantly
Solution Approach 1:
The patent employs a composite panel comprising a core material sandwiched between two outer layers, where the core has lower thermal conductivity than the outer layers. This composite structure enables effective heat sinking through the outer layers while the core provides structural support with reduced weight, achieving thermal management without excessive weight penalty
Solution Approach 2:
The panel design implements local quality by assigning different thermal conductivity properties to different regions: the outer layers have high thermal conductivity for heat dissipation, while the core material has lower thermal conductivity. This spatial differentiation of thermal properties allows the structure to perform heat sinking functions where needed while minimizing weight through the lighter core material
2Adaptability or versatility
If larger circuit boards are used to accommodate more electronic components, then functionality and component capacity increase, but physical stiffness and heat management become more difficult
Solution Approach 1:
The composite panel structure with high thermal conductivity outer layers provides effective heat management pathways across large circuit board areas, enabling larger boards to dissipate heat efficiently from multiple electronic components while maintaining structural integrity
Solution Approach 2:
The panel is attached to the support structure in a manner that extends the thermal conduction pathways into the vertical dimension, creating three-dimensional heat sinking paths that improve heat management capability for large circuit boards without increasing the horizontal footprint
3Adaptability or versatility
If larger circuit boards are used to accommodate more electronic components, then functionality and component capacity increase, but structural stiffness decreases
Solution Approach 1:
The composite panel construction with a core material provides enhanced structural stiffness and support for large circuit boards. The core material, while having lower thermal conductivity, contributes to the overall mechanical strength and rigidity of the assembly, enabling larger boards to maintain physical stiffness
Solution Approach 2:
The panel is divided into contiguous sections that are attached to different portions of the support structure, creating a segmented reinforcement system that enhances overall structural stiffness across the large circuit board area through distributed support points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat sinking and physical stiffness, allowing for the use of larger circuit boards by providing efficient thermal paths and structural support without excessive weight.
Implementation Method 1
Each section can have a first thermal conductivity substantially parallel to the inner surface of the section and a second thermal conductivity substantially perpendicular to the inner surface of said section, and the first thermal conductivity can be greater than the second thermal conductivity
Data Source
AI summary
An electronic assembly can include a support structure, a circuit substrate coupled to a first portion of the support structure, and a composite material panel coupled to a second portion of the support structure. An electronic device can be coupled to a mounting surface of the circuit substrate and disposed within a space enclosed by walls of the support structure. The panel can include contiguous sections inner surfaces of which can be oriented within twenty-five degrees of parallel to said mounting surface. Each section can be significantly more thermally conductive generally parallel to the inner surface of the section than generally perpendicular to the inner surface.