Organic-Inorganic Composite Particles for LCD Spacer Creep
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Solution Overview
Problem
Conventional spacers for liquid crystal display elements, such as resin and silica particles, suffer from creep deformation under constant load, leading to reduced productivity and alignment accuracy due to stress relaxation, and existing polyorganosiloxane particles are insufficient in suppressing this deformation.
Innovation Solution
The development of organic-inorganic composite particles with a siloxane bond, where the displacement under load is within specific ranges (0.08d0≤Ds≤0.15d0) for 180 seconds, and the production method involves forming seed particles, growing them, and baking while maintaining the Si—C bond to suppress creep deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If resin particles are used as spacers, then flexibility is improved, but manufacturing precision deteriorates due to poor particle diameter precision
Solution Approach 1:
The invention uses organic-inorganic hybrid particles composed of polyorganosiloxane, combining the flexibility of organic materials with the precision of inorganic materials. This composite structure resolves the contradiction by achieving both adaptability (flexibility) and manufacturing precision (particle diameter control) simultaneously
2Manufacturing precision
If silica particles are used as spacers, then manufacturing precision is improved, but ease of operation deteriorates due to hardness affecting wiring
Solution Approach 1:
The polyorganosiloxane composite particles combine inorganic silica components providing precision with organic components providing flexibility, resolving the contradiction between manufacturing precision and ease of operation
3Manufacturing precision
If conventional polyorganosiloxane particles are used, then both precision and flexibility are improved, but productivity deteriorates due to creep deformation and stress relaxation
Solution Approach 1:
The invention changes the physical-chemical parameters of the particles by controlling particle diameter within 0.1-10μm and specific gravity within 1.8-2.2, and by controlling plastic deformation to 5% or less, achieving both precision and productivity
4Manufacturing precision
If conventional polyorganosiloxane particles are used, then precision is improved, but reliability deteriorates due to plastic deformation under load
Solution Approach 1:
The invention controls critical parameters including particle diameter (0.1-10μm), specific gravity (1.8-2.2), and plastic deformation (5% or less) to achieve both precision and long-term reliability under load
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The organic-inorganic composite particles exhibit reduced creep deformation, maintaining displacement stability over time under constant load, enhancing productivity and design properties by eliminating the need for stress relaxation considerations and ensuring long-term reliability.
Implementation Method 1
hydrolyze and condense the silicon compound to thereby form seed particles comprising a polyorganosiloxane having a Si—C bond
Implementation Method 2
hydrolyze and condense the silicon compound to thereby form seed particles comprising a polyorganosiloxane having a Si—C bond
Implementation Method 3
baking the dried solidified particles while maintaining the Si—C bond
Data Source
AI summary
The present invention provides organic-inorganic composite particles of which the creep deformation is further suppressed; and a method for producing the same. Organic-inorganic composite particles 10 include a compound having a siloxane bond and has a particle diameter d0, and when a load is applied such that an amount of displacement Ds satisfies 0.08d0≤Ds≤0.15d0 and is held for 180 seconds, conditions of the following Formulae (1) and (2) are satisfied:(D180−Ds)/d0≤1% Formula(1); and(Dmax−Ds)/d0≤1% Formula (2),wherein d0 is an average particle diameter, D180 is an amount of displacement of the particle diameter after 180 seconds of application of the load, and Dmax is the maximum amount of displacement of the particle diameter during the 180 seconds.