Organic-Inorganic Composite Particles for Thermal Conductivity
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Solution Overview
Problem
Existing organic-inorganic composite particles face issues with inorganic compounds detaching from resin surfaces, requiring complex manufacturing methods and additional components, which hinders their thermal conductivity and stability in applications like heat dissipation in electronic devices.
Innovation Solution
The development of organic-inorganic composite particles with vinyl polymers and thermally conductive inorganic particles, treated with acidic phosphoric acid ester and polymerizable compounds, ensuring stable adhesion and forming multiple layers for enhanced thermal conductivity without the need for additional polymers or complex processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inorganic compound is physically adsorbed on resin particle surfaces, then manufacturing is simple, but inorganic compound detaches and adhesion is poor
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary substance between the inorganic compound and resin particle surfaces. The silane coupling agent contains both inorganic reactive groups (for bonding to inorganic surfaces) and organic reactive groups (for bonding to resin), creating a chemical bridge that prevents detachment while maintaining manufacturing feasibility through surface treatment processes
Solution Approach 2:
The patent creates a composite structure where inorganic compounds are chemically bonded to resin particles through silane coupling agents, forming an organic-inorganic hybrid composite. This composite approach combines the thermal conductivity of inorganic materials with the adhesion benefits of chemically bonded interfaces, resolving the contradiction between simple physical adsorption and stable chemical attachment
2Reliability
If water-soluble polymer is used to adhere inorganic particles, then adhesion is improved, but manufacturing complexity increases due to additional insolubilization step
Solution Approach 1:
The patent extracts and eliminates the water-soluble polymer intermediary from the manufacturing process, replacing it with direct silane coupling agent treatment. This removal of the additional component and its associated insolubilization step simplifies the manufacturing process while maintaining reliable adhesion through the silane-based chemical bonding mechanism
Solution Approach 2:
The silane coupling agent serves as a direct intermediary that eliminates the need for water-soluble polymers. By providing both inorganic and organic reactive functionality in a single substance, the silane coupling agent achieves adhesion improvement without requiring the complex two-step process of polymer application and subsequent insolubilization
3Temperature
If inorganic particles are used as thermally conductive filler, then thermal conductivity is improved, but resin composition becomes rigid and heavy
Solution Approach 1:
The patent applies local quality by creating organic-inorganic composite particles where inorganic thermally conductive materials are selectively combined with organic resin components only where needed for thermal management. This localized composite approach provides thermal conductivity enhancement in specific regions while maintaining the overall lightweight and flexible characteristics of the organic resin matrix
Solution Approach 2:
The patent creates organic-inorganic composite particles that combine thermally conductive inorganic materials with organic resin, forming a hybrid filler that provides thermal conductivity while maintaining flexibility and lightweight properties. The composite structure allows heat dissipation functionality without the full rigidity and weight penalty of pure inorganic fillers
4Temperature
If inorganic particles form multiple layers on surface, then thermal conductivity is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-treating inorganic particles with silane coupling agents before combining them with resin particles. This pre-surface treatment establishes reactive functionality on inorganic particle surfaces in advance, enabling spontaneous and uniform layer formation during composite particle creation without requiring precise control of layer deposition parameters during final assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides stable, thermally conductive organic-inorganic composite particles that maintain inorganic compound adhesion, simplifying manufacturing and improving thermal conductivity when used as fillers in resin compositions, enhancing flexibility and lightweight properties.
Implementation Method 1
The inorganic particles are subjected to a surface treatment by acidic phosphoric acid ester having no polymerizable functional group, and by at least one polymerizable compound... The at least one polymerizable compound is bonded to the vinyl polymer
Implementation Method 2
The inorganic particles are unevenly located on surface layers of the organic-inorganic composite particles so that the inorganic particles form one or more layers... the thermal conductivity of the inorganic particles is 10 W/(m·K) or more
Data Source
AI summary
Organic-inorganic composite particles include: a vinyl polymer that is a polymer of a polymerizable vinyl monomer; and inorganic particles including inorganic oxide and/or inorganic nitride. The thermal conductivity of the inorganic particles is 10 W/(m·K) or more. The inorganic particles are subjected to a surface treatment by acidic phosphoric acid ester having no polymerizable functional group, and by at least one polymerizable compound selected from the group consisting of: carboxylic acid having a polymerizable functional group; acidic phosphoric acid ester having a polymerizable functional group; and lactone having a polymerizable functional group. The polymerizable compound is bonded to the vinyl polymer, and the inorganic particles are unevenly located on surface layers of the organic-inorganic composite particles so that the inorganic particles form one or more layers.