Composite Passive Interconnects for Multi-Chip Signal Latency
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Solution Overview
Problem
In semiconductor device miniaturization, existing technologies face challenges in achieving monolithic die performance due to increased signal latency caused by physical separation of components in multi-chip packages, which hinders efficient inter-chip signal transmission.
Innovation Solution
The implementation of composite passive interconnect channels using bridge dice with metallization that connects input-output circuits across multiple semiconductive devices, reducing signal latency by minimizing additional channel length and allowing electromagnetic signals to propagate efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If components are physically separated in multi-chip packages for miniaturization, then device integration density is improved, but signal latency increases
Solution Approach 1:
The patent transitions from planar 2D interconnect routing to 3D vertical interconnect structures, utilizing the Z-dimension through stacked die configurations and through-silicon vias to reduce signal path length while maintaining high integration density
Solution Approach 2:
The patent implements nested interconnect structures where multiple interconnect layers and routing paths are embedded within the vertical stack, allowing signals to propagate through optimized pathways that minimize latency while maintaining compact form factor
2Adaptability or versatility
If additional interconnect channels are added to connect physically separated components, then connectivity is improved, but channel length increases causing higher latency
Solution Approach 1:
The patent segments the interconnect path into multiple functional sections (on-die interconnects, bump joints, bridge die interconnects, passive channel segments) that can be independently optimized, allowing connectivity to be maintained while minimizing total propagation distance through strategic placement of active and passive components
Solution Approach 2:
The patent introduces bridge dice as intermediary components that provide passive interconnect channels between active dice, serving as mediators that extend connectivity without adding active signal processing elements that would increase latency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces signal latency to near-monolithic performance levels, enabling efficient communication across physically separated components in multi-chip packages by utilizing composite passive interconnect channels that minimize propagation delay.
Implementation Method 1
allowing electromagnetic signals to propagate efficiently
Data Source
AI summary
Inter-die passive interconnects are lengthened while locating I/O circuitry away from die edge, such that passive interconnect length is agglomerated toward the die edge, and inter-die communication is expedited.