Composite Pin Insertion Device for Irregular Thickness Laminates
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Solution Overview
Problem
Conventional z-pinning methods for composite laminated structures face challenges in efficiently reinforcing inter-layer strength, particularly in structures with irregular thickness, due to material waste, process inefficiency, and difficulty in achieving uniform pin insertion depth, which complicates equipment construction and application.
Innovation Solution
A device and method for inserting pins into composite laminated structures using reusable guides with adjustable length pins and load adding means, such as pressure, vibration, or gravity, to ensure accurate pin insertion depth and prevent material waste, allowing for efficient reinforcement of inter-layer strength across varying thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional z-pinning methods are used to reinforce inter-layer strength, then pin insertion depth cannot be uniformly controlled, but this leads to material waste and process inefficiency
Solution Approach 1:
The pin insertion device employs movable guides that can dynamically adjust their position and orientation during the insertion process. The guides are designed to move in response to the pin insertion force, automatically adapting to variations in laminate thickness and ensuring uniform pin insertion depth across different regions of the composite structure.
Solution Approach 2:
The device changes physical parameters during the pin insertion process, including the position, orientation, and movement characteristics of the guides. By controlling these parameter changes, the system achieves precise pin insertion depth while minimizing material waste through efficient pin utilization.
2Ease of manufacture
If conventional z-pinning methods are used, then the process is simple, but equipment construction becomes complex and application is difficult for irregular thickness structures
Solution Approach 1:
The pin insertion device is divided into multiple independent guide components, each responsible for a specific region or function. This segmentation allows each guide to be optimized for its specific task while simplifying the overall device construction and making it adaptable to various laminate configurations, including irregular thickness structures.
Solution Approach 2:
The guide structure is designed with multi-functional capabilities, serving multiple purposes such as guiding pin insertion, controlling insertion depth, and accommodating variations in laminate thickness. This universality reduces the need for multiple specialized components, thereby simplifying equipment construction while maintaining ease of application across different structures.
3Strength
If pins are inserted to reinforce inter-layer strength, then structural integrity improves, but the process becomes more complex and time-consuming
Solution Approach 1:
The guide structure is pre-configured with features that facilitate rapid pin insertion. The guides are positioned and oriented in advance to match the pin insertion requirements, eliminating the need for real-time adjustments during the pinning process. This preliminary action significantly reduces the time required for pin insertion while maintaining the reinforcement of inter-layer strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reinforces inter-layer separation performance, prevents material waste, and simplifies the application process for composite laminated structures with irregular thicknesses, ensuring high-quality pin insertion and improved structural integrity.
Implementation Method 1
load adding means, such as pressure, vibration, or gravity
Implementation Method 2
load adding means, such as pressure, vibration, or gravity
Data Source
AI summary
A composite laminated structure is reinforced by inserting pins into a device for manufacturing a composite laminated structure. The device has a bottom guide on a composite laminated structure in a pre- or post-cured state. The device has first vertical pins that are inserted into the composite laminated structure. A top guide, on the bottom guide, has guide pins that are movable in a vertical direction at positions corresponding to the first pins.


