Composite Polishing Pad Direct Layer Bonding

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Solution Overview

Problem

Conventional composite polishing pads face issues with adhesion layer failure, stress accumulation, and increased manufacturing complexity and costs due to the use of pressure-sensitive adhesives or hot-melt adhesives, leading to separation and deformation of layers during polishing.

Innovation Solution

A composite polishing pad with a direct contact between a cushion layer and a polishing layer, both made from polymeric elastomers, eliminating the need for an adhesion layer and simplifying the manufacturing process by omitting the lamination step, while ensuring strong chemical bonding and improved peel strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a pressure-sensitive adhesive layer is used to bond the cushion layer and polishing layer, then the layers can be bonded together, but the adhesion strength is low and chemical resistance is poor, causing layers to separate or peel off

Engineering Contradiction:
Improveadhesion strengthVSAvoidlayer bonding reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The invention removes the adhesion layer entirely from the polishing pad structure. Instead of using a separate adhesive layer that bonds the cushion layer and polishing layer, the invention allows these two layers to contact each other directly, eliminating the source of adhesion failure and chemical resistance problems.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the cushion layer and polishing layer into direct contact without an intermediate adhesion layer. This integration eliminates the weak interface that would otherwise exist between the cushion layer, adhesion layer, and polishing layer, creating a more reliable bonded structure.

Inventive Principle:
Principle #5Merging (Combining)

2Strength

If a hot-melt adhesive is used for bonding, then the layers can be bonded together, but stress accumulation occurs resulting in deformation of the polishing pad

Engineering Contradiction:
Improvebonding strengthVSAvoidpolishing pad deformation
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The invention extracts the hot-melt adhesive from the polishing pad structure, eliminating the source of stress accumulation and deformation. By removing the adhesive layer entirely, the patent avoids the thermal and mechanical stresses that would otherwise cause pad deformation during operation.

Inventive Principle:
Principle #2Taking out (Extraction)

3Strength

If an adhesion layer is used to laminate the cushion layer and polishing layer, then the layers can be bonded together, but a lamination step is added increasing process complexity and manufacturing costs

Engineering Contradiction:
Improvelayer bondingVSAvoidmanufacturing process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention removes the adhesion layer and the associated lamination process from the manufacturing workflow. This eliminates the need for separate bonding equipment and process steps, simplifying both the manufacturing process and reducing costs while maintaining layer integrity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention combines the cushion layer and polishing layer into a direct contact structure that eliminates the need for separate lamination steps. This integration simplifies the manufacturing process by reducing the number of process steps and equipment requirements.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution prevents layer separation and deformation, enhances polishing quality, reduces manufacturing complexity, and lowers costs by eliminating the adhesion layer, resulting in a more effective and efficient polishing process.

Implementation Method 1

drying the first resin coating and the second resin coating at a second temperature, so that the first resin coating becomes a cushion layer and the second resin coating becomes a polishing layer

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS9682457B2Composite polishing pad and method for making the same
Publication Date: 2017.06.20 SAN FANG CHEM IND
  • US9682457B2 patent drawing
  • US9682457B2 patent drawing
  • US9682457B2 patent drawing

AI summary

The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.