Composite Electronic Component Size Reduction via Resin Burial
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Solution Overview
Problem
Existing composite electronic components are limited in size reduction and require time-consuming and labor-intensive mounting processes due to the need for separate substrates and connection terminals.
Innovation Solution
A composite electronic component is created by integrating a first and second electronic component with a resin body, where the components' outer electrodes are exposed for connection, eliminating the need for separate substrates and terminals, and allowing for modularization and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a substrate is provided to integrate the coil element and capacitance element, then the components can be integrated with each other, but the composite electronic component cannot be reduced in size
Solution Approach 1:
The patent extracts and eliminates the substrate from the composite electronic component structure. Instead of using a substrate to integrate the coil element and capacitance element, the invention directly combines these components, thereby removing the unnecessary substrate and reducing the overall size of the composite electronic component while maintaining integration functionality.
2Ease of operation
If connection terminals are provided on the second surface of the capacitance element for mounting, then the component can be connected to the mounting substrate, but this takes time and labor for the work involved
Solution Approach 1:
The patent merges the connection terminals with the outer surfaces of the capacitance element and coil element. By forming connection terminals on the outer surfaces that are already present on the components, the invention eliminates the need for separate connection terminal structures and reduces the mounting process steps, thereby reducing time and labor while maintaining ease of operation.
3Stability of the object's composition
If different materials are co-fired to create the composite component, then integration is achieved, but issues like delamination occur
Solution Approach 1:
The patent changes the manufacturing parameters by using a single-firing process instead of co-firing different materials at different temperatures. By forming both the capacitance element and coil element in a single firing process, the invention eliminates thermal expansion differences and stress mismatches that cause delamination, thereby improving reliability while maintaining component integration.
Data Source
AI summary
A composite electronic component that includes a first electronic component that includes a first element body, a first functional element that is provided inside the first element body, and first outer electrodes that are provided on one surface of the first element body and are electrically connected to the first functional element. A second electronic component includes a second element body, a second functional element that is provided inside the second element body, and second outer electrodes that are provided on one surface of the second element body and are electrically connected to the second functional element. A resin body, in which the first electronic component and the second electronic component are buried, exposes the first outer electrodes and the second outer electrodes from the resin body.