Composite Resin Receiving Layer for Conductive Ink Adhesion
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Solution Overview
Problem
Existing methods for producing conductive patterns face challenges in achieving high adhesion to supports, preventing bleeding and separation, especially when exposed to chemical agents and heat, which affects the durability and integration density of electronic circuits.
Innovation Solution
A resin composition combining urethane and vinyl polymers with specific alicyclic structures and hydrophilic groups is used to form a receiving layer that provides excellent adhesion and durability, preventing separation even under heat and chemical exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a latex layer is used as the ink-receiving layer to form a conductive pattern, then the adhesion to the support is improved, but bleeding of the conductive ink occurs and the printing thickness becomes uneven
Solution Approach 1:
The patent uses a composite ink-receiving layer formed by combining latex resin and polyurethane resin in specific proportions (latex resin: 10-70 parts by mass, polyurethane resin: 30-90 parts by mass). This composite structure provides both adhesion (from latex) and bleeding prevention (from polyurethane), resolving the contradiction between adhesion strength and printing precision.
2Ease of manufacture
If the conductive ink is printed directly on the support surface, then the process is simplified, but the conductive ink does not readily adhere and is easily separated
Solution Approach 1:
The patent applies a preliminary ink-receiving layer treatment before printing the conductive ink. The ink-receiving layer is formed with specific resin composition and controlled drying conditions (drying at 50-100°C for 1-10 minutes) to create an optimal surface that ensures subsequent conductive ink adhesion, preventing separation while maintaining process simplicity.
3Strength
If the ink-receiving layer is formed of a latex layer, then adhesion is improved, but the layer is readily degraded by heat during baking and separation occurs
Solution Approach 1:
The patent creates a heat-resistant composite ink-receiving layer by combining latex resin with polyurethane resin that has superior thermal stability. The polyurethane resin (30-90 parts by mass) acts as a thermal stabilizer, maintaining adhesion properties even during high-temperature baking processes, thus preventing heat-induced separation.
4Productivity
If a fine line width of 0.01 to 200 μm is required to increase integration density, then the electronic circuit performance is improved, but bleeding of the conductive ink prevents formation of such fine lines
Solution Approach 1:
The patent uses a composite resin system (latex + polyurethane) where the polyurethane component provides bleeding resistance, enabling precise formation of fine conductive lines with widths of 0.01-200 μm. This allows high integration density electronic circuits to be manufactured with controlled line dimensions.
5Reliability
If the conductive pattern is exposed to chemical agents for plating, then the electrical conduction property is maintained, but the ink-receiving layer separates from the support
Solution Approach 1:
The patent employs a composite ink-receiving layer where polyurethane resin provides chemical resistance to plating agents while latex resin maintains adhesion. This composite structure allows the conductive pattern to undergo plating treatment for enhanced electrical conduction without causing layer separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of conductive patterns with improved adhesion and durability, allowing for fine-line formation and maintaining electrical conduction properties, suitable for various electronic applications including flexible circuits and organic solar cells.
Implementation Method 1
an ink-receiving layer having excellent adhesion to a support
Implementation Method 2
capable of forming a receiving layer which has excellent printing properties without causing bleeding of a fluid such as an ink
Data Source
AI summary
An object to be achieved by the present invention is to provide a resin composition for forming a receiving layer, the resin composition being capable of forming, among receiving layers that can carry a fluid such as an ink, a receiving layer having excellent adhesion to various types of supports and capable of forming a receiving layer which has excellent printing properties without causing bleeding of a fluid such as an ink. The present invention relates to a resin composition for forming a receiving layer, the resin composition containing a urethane resin (A), a vinyl polymer (B), and an aqueous medium (C), in which the urethane resin (A) has an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg relative to the total amount of the urethane resin (A), and a hydrophilic group.