Composite Electronic Component Resistance Element Height Design
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Solution Overview
Problem
Existing composite electronic components face issues with defective joining between electronic elements due to the functional portion on the substrate-type electronic element coming into contact with other elements, leading to insufficient connection.
Innovation Solution
A composite electronic component design featuring an insulating base portion with a resistor and protective film, where the upper surface conductors are strategically positioned to prevent contact with external electrodes, ensuring proper alignment and connection between the resistance element and the electronic element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a functional portion (resistor) is provided on the upper surface of the insulating base portion, then the degree of freedom in circuit design is improved, but the risk of contact with other electronic elements increases causing defective joining
Solution Approach 1:
The patent resolves the contradiction by transitioning from a two-dimensional surface layout to a three-dimensional spatial arrangement. The functional portion is positioned at a lower height on the insulating base portion, creating vertical separation from the upper surface where other electronic elements are mounted. This dimensional change allows the functional portion to remain electrically accessible while physically avoiding contact with other elements, thus maintaining both design freedom and joining reliability.
Solution Approach 2:
The patent applies preliminary action by pre-positioning the functional portion at a controlled height below the upper surface of the insulating base portion before mounting other electronic elements. This advance positioning ensures that when other elements are subsequently mounted on the upper surface, they cannot contact the functional portion, preventing defective joining while preserving circuit design flexibility.
Data Source
AI summary
A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and a first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on the upper surface of the base portion, a protective film, and first to third upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction, and the resistor and the third upper surface conductor connected thereto are located between the first and the second upper surface conductors. Dimensions in the height direction from the upper surface of the base portion to the surfaces of the first and second upper surface conductors are larger than dimension in the height direction from the upper surface of the base portion to the surface of the portion overlapped with the protective film in the height direction of the third upper surface conductor.