Composite Sensor Laminated Substrates Chip Size Reduction
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Solution Overview
Problem
Existing integrated pressure and acceleration sensors face challenges in reducing chip size while minimizing mutual interference and ensuring reliable operation, with current solutions either resulting in large chip size, isolation of the pressure sensor, or risk of damage from mutual interference.
Innovation Solution
A composite sensor design involving laminated substrates with a pressure sensor and acceleration sensor, where a pressure film is spaced from one substrate to form a pressure cavity and a proof mass is spaced from another to form an anti-collision cavity, reducing chip size and isolating components to prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the pressure sensor is embedded into the proof mass of the acceleration sensor, then the chip size is reduced, but the pressure sensor is isolated from the outside and loses its detection function
Solution Approach 1:
The sensor is divided into two separate substrates: the first substrate contains the pressure sensor with pressure-sensitive elements, while the second substrate contains the acceleration sensor with proof mass. This segmentation allows each sensor to function independently while being integrated into a compact composite structure, solving the problem of pressure sensor isolation.
Solution Approach 2:
The pressure sensor and acceleration sensor are nested within each other's structural space. The first substrate with pressure sensor is positioned beneath the second substrate with acceleration sensor, creating a nested configuration where both sensors coexist in a minimized footprint without interfering with each other's functionality.
2Adaptability or versatility
If the pressure film is directly exposed within the accessible space of the proof mass, then integration is achieved, but there is mutual interference between pressure and acceleration sensing
Solution Approach 1:
The sensing elements are segmented and placed on separate substrates: pressure-sensitive elements on the first substrate and proof mass on the second substrate. This spatial segmentation eliminates mutual interference while maintaining integration benefits, as each sensor operates in its dedicated zone without cross-interference.
Solution Approach 2:
The solution transitions from planar integration to three-dimensional stacking. By utilizing the vertical dimension with two stacked substrates, the patent achieves integration without the mutual interference problems of planar arrangements, as the pressure film is no longer exposed within the proof mass's accessible space.
3Adaptability or versatility
If the pressure sensor and acceleration sensor are integrated in a same plane, then integration is achieved, but the chip size becomes relatively large
Solution Approach 1:
The patent transitions from two-dimensional planar integration to three-dimensional stacked integration. By stacking the first substrate (pressure sensor) and second substrate (acceleration sensor) vertically, the chip area is significantly reduced while maintaining full functionality of both sensors.
Solution Approach 2:
The two sensors are nested in a vertical configuration where one substrate is positioned beneath the other. This nesting approach minimizes the horizontal footprint of the integrated sensor while preserving the functional independence and sensing capabilities of both pressure and acceleration sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces chip size and minimizes mutual interference between the pressure and acceleration sensors, enhancing the reliability of the composite sensor by isolating the pressure film and proof mass.
Implementation Method 1
a first piezoresistor and a second piezoresistor, which are arranged along a diagonal line of a square pressure-sensitive area of the pressure film
Implementation Method 2
an acceleration sensor located on the second substrate and configured to sense a change in acceleration
Data Source
AI summary
The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.