Composite Material Separation with Dual-Laser Crack-Free End Faces
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Solution Overview
Problem
Existing methods for dividing composite materials with brittle and resin layers often result in cracked brittle material ends and thermally deteriorated resin ends, with high process costs and risks of resin peeling or quality deterioration.
Innovation Solution
A method involving a resin removing step using a CO2 laser to form a processed groove, followed by a brittle material removing step using an ultrashort pulse laser to create a processing mark with through holes, allowing for division without external force, thereby preventing cracks and thermal deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser processing or mechanical methods are used to divide the composite material, then the brittle material layer can be divided, but cracks occur in the end face of the brittle material layer and the resin layer suffers thermal deterioration
Solution Approach 1:
The invention segments the laser processing into two distinct steps: first removing the resin layer completely, then processing the brittle material layer. This segmentation prevents the ultrashort pulse laser from transmitting through the brittle material and causing thermal deterioration to the resin layer, while also preventing cracks in the brittle material end face by avoiding mechanical stress from external force application.
Solution Approach 2:
The resin layer is removed in advance before processing the brittle material layer. This preliminary action eliminates the risk of thermal deterioration to the resin layer from subsequent ultrashort pulse laser processing, and allows the brittle material layer to be processed independently without causing cracks that would occur with external force application.
2Manufacturing precision
If polishing treatment is applied to improve the quality of the brittle material end face, then the surface quality improves, but the process cost increases and the resin layer may peel off
Solution Approach 1:
The invention replaces mechanical polishing treatment with ultrashort pulse laser processing. The ultrashort pulse laser creates a smooth end face through ablation without mechanical contact, eliminating the need for polishing equipment and reducing process complexity while maintaining high surface quality.
Solution Approach 2:
The invention changes the processing parameters by using ultrashort pulse laser with specific pulse widths (10^-12 to 10^-9 seconds) and wavelengths suitable for the brittle material. This parameter change allows direct laser processing to achieve surface quality comparable to or better than mechanical polishing, eliminating the need for additional polishing steps.
3Manufacturing precision
If cleaning treatment is applied to improve the quality of the brittle material end face, then the surface cleanliness improves, but the process cost increases and the resin layer quality deteriorates
Solution Approach 1:
The invention replaces mechanical cleaning treatment with ultrashort pulse laser processing. The laser ablation process inherently produces a clean end face without requiring separate cleaning steps, eliminating the need for cleaning equipment and reducing process complexity while maintaining high surface cleanliness.
Solution Approach 2:
The invention extracts the cleaning function from the processing system by using ultrashort pulse laser ablation that inherently produces a clean surface. The laser removes material precisely along the division line without generating contaminants that would require separate cleaning, thereby eliminating the cleaning step and its associated costs and risks.
4Manufacturing precision
If ultrashort pulse laser light is radiated from the brittle material layer side to divide the composite material, then the brittle material can be divided without cracks, but the resin layer suffers thermal deterioration from transmitted laser light
Solution Approach 1:
The invention segments the processing into two sequential steps: first removing the resin layer completely, then processing the brittle material layer from its exposed surface. This segmentation ensures that the ultrashort pulse laser only interacts with the brittle material, preventing any laser transmission that would cause thermal deterioration to the resin layer while maintaining crack-free division of the brittle material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables division of composite materials without cracking the brittle material ends or thermally deteriorating the resin ends, reducing process costs and improving quality by carefully removing each layer with precise laser processing.
Implementation Method 1
radiating a laser light oscillated from a laser source to the resin layer and thereby removing the resin forming the resin layer
Implementation Method 2
radiating a laser light oscillated from an ultrashort pulse laser source to the brittle material layer and thereby removing the brittle material forming the brittle material layer
Data Source
Figure 1A~1C
Figure 2A~2B
Figure 3A~3D
AI summary
[Problem to be Solved] Provided is a method capable of dividing a composite material without causing a crack in an end face of a brittle material layer after being divided, or serious thermal deterioration of an end face of the resin layer after being divided. [Solution] The present invention is a method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a resin removing step of radiating a laser light L1 oscillated from a CO2 laser source 20 to the resin layer along the scheduled dividing line DL of the composite material and thereby forming a processed groove 24 along the scheduled dividing line; a brittle material removing step of radiating a laser light L2 oscillated from an ultrashort pulse laser source 30 to the brittle material layer along the scheduled dividing line and thereby forming a processing mark 11 along the scheduled dividing line, after the resin removing step; and a composite material dividing step of dividing the composite material by applying an external force along the scheduled dividing line after the brittle material removing step. The method is characterized in that the processing mark to be formed in the brittle material removing step is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 µm or less.