Composite Sheet with Graphite and Aerogel for Thin Device Heat Insulation
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Solution Overview
Problem
Existing heat dissipation solutions for electronic components, such as graphite and heat insulating material laminated sheets, fail to provide sufficient heat insulation, especially in smaller devices where thickness reductions lead to decreased performance, causing heat to concentrate on the housing and potentially leading to low-temperature burns.
Innovation Solution
A composite sheet comprising a graphite layer for high-temperature areas, an aerogel layer for low-temperature areas, and an adhesive layer with water as a dispersant or solvent, where the aerogel layer has a smaller area than the graphite layer and is positioned near the electronic component, effectively reducing heat conduction to the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of heat insulating material is reduced to accommodate smaller device sizes, then device compactness is improved, but heat insulating performance deteriorates
Solution Approach 1:
The patent uses a composite structure combining graphite layer and aerogel layer to achieve superior heat insulating performance in a thin profile. The graphite layer provides thermal diffusion while the aerogel layer provides insulation, creating a composite material system that resolves the contradiction between thinness and insulating effectiveness.
Solution Approach 2:
The patent applies different materials with different thermal properties to different regions: graphite layer contacts the heat-generating component for heat diffusion, while aerogel layer faces the housing for insulation. This local differentiation of material properties optimizes heat management at each interface.
2Ease of manufacture
If conventional heat insulating materials (glass wool, rock wool, natural wool) are used, then heat insulation is provided, but sufficient heat insulating performance cannot be obtained in thin configurations
Solution Approach 1:
The patent changes the material parameters by selecting aerogel instead of conventional insulating materials. Aerogel has superior thermal insulation properties per unit thickness, allowing the system to achieve the required insulation performance in a much thinner configuration than glass wool, rock wool, or natural wool would allow.
3Length of stationary object
If heat insulating layer is made thinner, then device thickness is reduced, but heat concentration on housing increases
Solution Approach 1:
The patent introduces a lateral heat diffusion dimension by placing the graphite layer between the heat-generating component and the insulating layer. This graphite layer spreads heat laterally across the interface, preventing heat concentration at any single point on the housing, while the overall structure remains thin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite sheet achieves superior heat insulating performance even in narrow spaces within electronic devices, efficiently reducing heat conduction from heat-generating components to the housing, thereby preventing overheating and potential burns.
Implementation Method 1
Heat generated in the component is diffused in the thermally conductive layer 12
Implementation Method 2
heat insulating layer 13...heat diffusion stops in the heat insulating layer 13...heat is not locally conducted to the housing 14
Data Source
AI summary
A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps.