Composite Sheet Metal Component Integrating Semiconductor Devices
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Solution Overview
Problem
Conventional composite sheet metal components used in vehicles lack integrated functional properties, necessitating multiple components and increasing weight, complexity, and manufacturing costs.
Innovation Solution
A composite sheet metal component comprising an inner metal sheet, an outer metal sheet, and an intermediate polymer sheet with a semiconductor device integrated within, allowing for reduced component count, weight, and manufacturing complexity by using conventional manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional composite sheet metal components are used without integrated functional devices, then the manufacturing process remains simple and component structure remains straightforward, but the number of components increases and functional integration is lost
Solution Approach 1:
The patent merges the semiconductor device with the intermediate polymer sheet by integrating the semiconductor device into a cavity formed in the polymer sheet. This combining approach allows the body panel to incorporate functional capabilities (such as sensors, actuators, or electronic components) directly within the panel structure, eliminating the need for separate mounting brackets or housing structures. The semiconductor device becomes an integral part of the composite sheet metal component, achieving functional integration while maintaining a unified component structure.
Solution Approach 2:
The intermediate polymer sheet serves multiple functions: it provides structural support as part of the composite panel, contains cavities for housing semiconductor devices, and acts as an integrating medium that combines structural and functional elements into a single component. This multi-functionality allows the same component to fulfill both structural and electronic functional roles, reducing the total number of parts needed in the vehicle assembly.
2Weight of moving object
If multiple separate components are used to provide both structural and functional properties, then manufacturing processes remain conventional and simple, but vehicle weight increases and package space decreases
Solution Approach 1:
The patent combines multiple separate components (structural panel elements and functional semiconductor devices) into a single integrated composite sheet metal component. By housing the semiconductor device within a cavity in the intermediate polymer sheet, the design eliminates the need for separate mounting brackets, housings, and fasteners. This merging reduces the total material mass and component count, thereby reducing vehicle weight while still allowing conventional manufacturing processes to be used for producing the integrated component.
Solution Approach 2:
The semiconductor device is nested within a cavity formed in the intermediate polymer sheet, which itself is nested between the inner and outer metal sheets to form the composite panel. This nesting arrangement allows the functional device to be contained within the structural component without requiring additional external housing or mounting structures. The nested configuration reduces overall component volume and vehicle package space requirements while maintaining ease of manufacture through conventional processes.
3Object-affected harmful factors
If conventional composite sheet metal components are used, then manufacturing processes remain conventional and cost-effective, but aerodynamic performance is compromised due to additional external parts
Solution Approach 1:
The patent merges the semiconductor device housing with the body panel structure itself, eliminating the need for separate external mounting brackets or housings that would protrude from the vehicle surface. By integrating the functional device within the composite panel's intermediate polymer layer, the exterior surface remains smooth and continuous, reducing aerodynamic drag. The conventional manufacturing processes can still produce this integrated design by forming cavities in the polymer sheet during panel fabrication.
4Device complexity
If semiconductor devices are integrated within the intermediate polymer sheet, then component count reduces and weight decreases, but the semiconductor device height must be constrained within the polymer sheet thickness
Solution Approach 1:
The patent employs parameter changes by adjusting the thickness of the intermediate polymer sheet to accommodate different semiconductor device heights. The polymer sheet thickness is designed as a variable parameter that can be optimized during the design phase to fit specific semiconductor devices while maintaining the overall structural integrity of the composite panel. This parameter adjustment allows flexibility in selecting different semiconductor devices without requiring changes to the fundamental integration approach or conventional manufacturing processes.
Data Source
AI summary
A composite sheet metal component for an automobile comprises an inner metal sheet, an outer metal sheet and an intermediate polymer sheet arranged between the inner and the outer metal sheet. The intermediate polymer sheet comprises a semiconductor device and the outer metal sheet comprises at least one functional area.