Composite Component Sidewall Structure for Moisture-Resistant Sealing
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Solution Overview
Problem
Conventional composite components face issues of cracking and moisture ingress due to insufficient strength and high hygroscopicity of mold layers, leading to reliability degradation.
Innovation Solution
The composite component design includes sidewall portions at opposite ends to enhance strength and reduce resin sealing portion exposure, featuring a Si base layer, redistribution layer, through-Si vias, and resin sealing to prevent moisture entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mold layers are used to seal electronic components, then sealing function is provided, but cracking occurs and moisture enters from the outside due to insufficient strength and high hygroscopicity
Solution Approach 1:
The invention divides the sealing structure into multiple functional parts: sidewall portions formed from the substrate, and a resin sealing portion filling the recessed area. This segmentation allows each part to perform its specialized function - the sidewalls provide structural strength while the resin provides sealing, resolving the contradiction between strength and sealing reliability.
Solution Approach 2:
The invention uses composite construction by combining the substrate material (forming sidewalls) with a resin sealing portion. This composite approach allows the structure to benefit from both the mechanical strength of the substrate and the sealing properties of the resin, simultaneously improving strength and sealing reliability.
2Reliability
If mold layers are used to seal electronic components, then sealing function is provided, but moisture enters from the outside due to large exposed areas of mold layers with high hygroscopicity
Solution Approach 1:
The invention extracts the sealing function from the mold layers and assigns it to a dedicated resin sealing portion. By separating the sealing function from the structural sidewalls, the resin can be optimized specifically for moisture protection, preventing moisture ingress while the sidewalls maintain structural integrity.
Solution Approach 2:
The resin sealing portion acts as a flexible sealing layer that conforms to the recessed area formed by the sidewalls. This flexible sealing film effectively blocks moisture pathways, providing superior moisture protection compared to traditional mold layer configurations.
3Reliability
If resin sealing portion is exposed at opposite end surfaces, then sealing is provided, but strength is reduced and moisture entry is facilitated
Solution Approach 1:
The invention takes preliminary anti-action by forming sidewall portions that extend to the opposite end surfaces of the substrate before applying the resin sealing portion. This pre-formed structural barrier prevents moisture ingress pathways and maintains strength, while the resin sealing portion then provides additional sealing without being exposed at the ends.
Data Source
AI summary
A composite component containing one or more electronic components. The composite component includes a Si base layer having a first main surface, and a second main surface facing the first main surface, a redistribution layer disposed on the first main surface, a through-Si via extending through the Si base layer and the adhesive layer to electrically connect the redistribution layer and the electronic component, and extending through the Si base layer, an electronic component electrically connected to the through-Si via, and disposed on the second main surface, sidewall portions surrounding the electronic component, and disposed to form a recessed portion together with the Si base layer, and a resin sealing portion sealing the electronic component.