Composite Silicon Resin Mask for Vapor Deposition Precision

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Solution Overview

Problem

As the thickness of silicon substrates decreases, the precision of vapor deposition layers increases, but the masks become more prone to damage during handling.

Innovation Solution

A mask comprising a first layer with silicon, a second layer with a resin material, and an intermediate layer, where the first layer has recessed portions on its wall surfaces to enhance adhesion and prevent damage during movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the thickness of the silicon substrate is decreased, then the precision of the vapor deposition layer is improved, but the mask becomes more prone to damage during handling

Engineering Contradiction:
Improveprecision of vapor deposition layerVSAvoiddamage resistance of mask
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The mask is constructed as a composite structure with a first layer containing silicon and a second layer containing a resin material (such as polyimide). This composite design allows the thin silicon layer to provide high precision for vapor deposition while the resin layer provides mechanical strength and damage resistance during handling. The patent specifically describes this as a multilayer structure where each layer contributes different properties to resolve the contradiction between precision and strength.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If the thickness of the silicon substrate is decreased, then the precision of the vapor deposition layer is improved, but the reliability of the mask during movement is reduced

Engineering Contradiction:
Improveprecision of vapor deposition layerVSAvoidreliability of mask during movement
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent employs a composite structure combining a thin silicon layer with a resin material layer. The silicon layer maintains high precision for vapor deposition operations, while the resin layer provides mechanical protection and reliability during movement and handling. This composite approach allows the mask to be both precise and reliable simultaneously.

Inventive Principle:
Principle #40Composite materials

3Manufacturing precision

If a thin silicon mask is used, then the precision of the vapor deposition layer is improved, but the ease of operation is reduced due to fragility

Engineering Contradiction:
Improveprecision of vapor deposition layerVSAvoidease of handling mask
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The mask combines a thin silicon layer for precision with a resin material layer for mechanical strength. This composite structure makes the mask easier to handle and operate with, as the resin layer prevents the fragile thin silicon from breaking during normal operations, while still allowing the thin silicon to provide the needed precision for vapor deposition.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The mask design effectively prevents damage during handling and maintains precision in vapor deposition layers, ensuring high element density and uniformity in organic EL display devices.

Implementation Method 1

the first wall surface includes multiple recessed portions that are arranged in a thickness direction of the first layer

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20250146121A1Mask and method of manufacturing mask
Publication Date: 2025.05.08 DAI NIPPON PRINTING CO LTD
  • US20250146121A1 patent drawing
  • US20250146121A1 patent drawing
  • US20250146121A1 patent drawing

AI summary

A mask includes a first layer that includes a first surface, a second surface that is located opposite the first surface, at least one first opening that extends from the first surface to the second surface, and a first wall surface that faces the first opening, a second layer that includes a third surface that faces the second surface, a fourth surface that is located opposite the third surface, and multiple second openings that extend from the third surface to the fourth surface and that overlap the first opening in plan view, and a first intermediate layer that is located between at least the second surface and the third surface. The first layer contains silicon. The second layer contains a resin material. The first wall surface includes multiple recessed portions that are arranged in a thickness direction of the first layer.