Composite Spacer Package Layout to Limit Warpage in Chip Stacking
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Solution Overview
Problem
The challenge is to efficiently arrange an increasing number of devices in the finite areas of semiconductor packages, while also reducing the size and weight of electronic components and devices.
Innovation Solution
A semiconductor package design that includes a base substrate, a composite spacer with a first device region and a buffer region, and multiple semiconductor chips stacked on the spacers, where the composite spacer integrates a semiconductor device and a buffer region without exposing the device region to external cutting, enhancing mechanical properties and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor devices are arranged in finite package areas, then device density increases, but manufacturing complexity and risk of defects increase
Solution Approach 1:
The package structure is segmented into multiple independent spacer regions (first spacer, second spacer, third spacer) that can be manufactured separately and then assembled. Each spacer can be processed independently on different substrates, allowing complex multi-device packages to be built from simpler modular components, thereby reducing overall manufacturing complexity while maintaining high device density
Solution Approach 2:
Multiple spacers are stacked vertically to form a multi-layer structure where spacers are nested in the vertical dimension. This nesting approach allows multiple device regions to be arranged in three-dimensional space rather than just two dimensions, increasing device capacity without proportionally increasing package footprint or manufacturing complexity
2Ease of operation
If cutting is performed to expose device regions for electrical connection, then electrical connectivity is achieved, but mechanical strength decreases and warpage risk increases
Solution Approach 1:
Connection terminals serve as intermediary elements that provide electrical connection between the embedded device region and external circuits without requiring cutting of the spacer. The terminals are disposed between the device region and the exterior, acting as a mediator that achieves electrical connectivity while preserving the spacer's structural integrity and avoiding warpage-inducing cuts
Solution Approach 2:
Instead of exposing device regions through lateral cutting (2D approach), the invention uses vertically extending connection terminals that reach through the spacer structure (3D approach). This dimensional shift allows electrical connection to be achieved from the vertical direction, maintaining the spacer's horizontal structural strength while providing accessible electrical contacts
3Ease of operation
If device regions are exposed through cutting, then electrical connections can be made, but productivity decreases due to additional processing steps
Solution Approach 1:
The device region is pre-positioned within the spacer structure during spacer fabrication, and connection terminals are pre-formed to interface with the device. This preliminary arrangement eliminates the need for post-fabrication cutting operations to expose device regions, streamlining the manufacturing process and improving productivity while maintaining electrical connection capability
Data Source
AI summary
A semiconductor package includes: a base substrate; a first spacer disposed on the base substrate; a composite spacer disposed on the base substrate and laterally spaced apart from the first spacer; a plurality of first semiconductor chips stacked on the composite spacer; and a plurality of second semiconductor chips stacked on the first spacer, wherein a portion of the composite spacer includes a first device region, wherein a remaining portion of the composite spacer includes a buffer region, wherein the first device region includes a semiconductor device, wherein the buffer region does not comprise a semiconductor device, and the first spacer does not comprise a semiconductor device.