Composite Substrate for Heat Dissipation and Circuitry
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Solution Overview
Problem
Circuit boards are ineffective at transferring heat generated by electronic components to copper clads, while copper clads are inadequate for circuitry arrangement, necessitating a substrate that balances both heat distribution and circuitry capabilities.
Innovation Solution
A composite substrate comprising a lead frame with a chip mounting area and metal leads, a circuit board bridging the gaps between metal leads and the chip mounting area, and a conductive pattern structure for electrical coupling, allowing for effective heat dissipation and circuitry arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a circuit board is used as substrate, then circuitry arrangement capability is improved, but heat distribution capability deteriorates
Solution Approach 1:
The patent merges a circuit board with a lead frame to create a composite substrate. The circuit board provides excellent circuitry arrangement capability while the lead frame provides superior heat distribution capability. This combination allows the substrate to simultaneously achieve both circuitry arrangement excellence and heat distribution effectiveness, resolving the technical contradiction between these two opposing requirements.
Solution Approach 2:
The patent employs a composite substrate structure consisting of a circuit board and a lead frame bonded together. This composite structure integrates the advantages of both materials: the circuit board's excellent circuitry arrangement capabilities and the lead frame's superior thermal conductivity. The composite material approach enables the substrate to fulfill both circuitry and heat dissipation requirements that neither material could satisfy alone.
2Temperature
If a copper clad is used as substrate, then heat distribution capability is improved, but circuitry arrangement capability deteriorates
Solution Approach 1:
The patent merges a circuit board with a lead frame to create a composite substrate. The circuit board provides excellent circuitry arrangement capability while the lead frame provides superior heat distribution capability. This combination allows the substrate to simultaneously achieve both circuitry arrangement excellence and heat distribution effectiveness, resolving the technical contradiction between these two opposing requirements.
Solution Approach 2:
The patent employs a composite substrate structure consisting of a circuit board and a lead frame bonded together. This composite structure integrates the advantages of both materials: the circuit board's excellent circuitry arrangement capabilities and the lead frame's superior thermal conductivity. The composite material approach enables the substrate to fulfill both circuitry and heat dissipation requirements that neither material could satisfy alone.
3Temperature
If a lead frame is used as substrate, then heat distribution capability is improved, but circuitry arrangement capability deteriorates
Solution Approach 1:
The patent merges a circuit board with a lead frame to create a composite substrate. The circuit board provides excellent circuitry arrangement capability while the lead frame provides superior heat distribution capability. This combination allows the substrate to simultaneously achieve both circuitry arrangement excellence and heat distribution effectiveness, resolving the technical contradiction between these two opposing requirements.
Solution Approach 2:
The patent employs a composite substrate structure consisting of a circuit board and a lead frame bonded together. This composite structure integrates the advantages of both materials: the circuit board's excellent circuitry arrangement capabilities and the lead frame's superior thermal conductivity. The composite material approach enables the substrate to fulfill both circuitry and heat dissipation requirements that neither material could satisfy alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite substrate achieves both efficient heat dissipation for high-heat components and adequate circuitry arrangement, addressing the limitations of traditional substrates by integrating the benefits of lead frames and circuit boards.
Implementation Method 1
a lead frame having a chip mounting area and a plurality of metal leads arranged along a periphery of said chip mounting area
Implementation Method 2
a conductive pattern structure disposed over said lead frame and having circuitry, said conductive pattern structure bridging the gap between each said metal lead and said chip mounting area
Data Source
AI summary
A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.