Composite Substrate Manufacturing Synchronizing Pre-Bonding and Hot-Pressing
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Solution Overview
Problem
The existing manufacturing processes for flexible printed circuit boards face challenges in automating the pre-bonding and hot-pressing processes, leading to inefficiencies and defects due to differences in tack time, resulting in stalled boards and reduced productivity.
Innovation Solution
A system and method that integrate pre-bonding and hot-pressing into a continuous process, utilizing a transfer device to control the supply of composite boards with protection films, ensuring synchronized processing and preventing sagging, by adjusting the supply amount based on the time difference between pre-bonding and hot-pressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pre-bonding process is performed separately from the hot-pressing process, then the pre-bonding can be completed with adequate tack time, but the printed circuit board cannot be continuously transferred to the hot-press apparatus, causing the board to sag and reducing productivity
Solution Approach 1:
The patent combines the pre-bonding apparatus and hot-press apparatus into a single integrated device. The pre-bonding unit and hot-press unit are merged such that the printed circuit board can undergo both pre-bonding and hot-pressing in continuous sequence without interruption, eliminating the sagging problem and enabling continuous production while maintaining adequate bonding quality through the integrated design.
Solution Approach 2:
The integrated apparatus enables continuous processing where the printed circuit board moves continuously from the pre-bonding unit to the hot-press unit without stopping or being stored in between. This continuous action eliminates idle time and prevents board sagging, thereby improving productivity while maintaining bonding quality through uninterrupted processing.
2Ease of operation
If the printed circuit board is stored in roll form between pre-bonding and hot-pressing, then the board can be supplied to the hot-press apparatus, but the productivity is lowered due to the need to move and unwind rolls
Solution Approach 1:
By merging the pre-bonding and hot-pressing processes into a single integrated apparatus, the patent eliminates the need for intermediate storage in roll form. The board is directly transferred from the pre-bonding unit to the hot-press unit within the same device, removing the cumbersome steps of rolling, moving, and unwinding while maintaining ease of operation through automated continuous processing.
Solution Approach 2:
The integrated apparatus acts as an intermediary system that directly connects the pre-bonding and hot-pressing processes. Instead of using roll storage as an intermediary, the apparatus provides a direct transfer mechanism (such as a conveyer system) that moves the board continuously between processing units, eliminating the need for manual rolling and unwinding operations.
3Manufacturing precision
If the pre-bonding process time is 30 to 60 seconds and the hot-pressing process time is 240 to 300 seconds, then each process can be optimized for its specific requirements, but the difference in tack time causes transfer problems and board sagging
Solution Approach 1:
The integrated apparatus merges the pre-bonding and hot-pressing units into a single system where the board is processed sequentially without interruption. This allows each process to maintain its optimized timing (30-60 seconds for pre-bonding, 240-300 seconds for hot-pressing) while the continuous transfer mechanism prevents board sagging by eliminating idle time between processes.
Solution Approach 2:
The pre-bonding process is performed as a preliminary action before hot-pressing in the integrated apparatus. The board undergoes pre-bonding first (30-60 seconds) to establish initial adhesion, then immediately proceeds to hot-pressing (240-300 seconds) for final bonding. This preliminary action sequence is built into the integrated system to prevent sagging while maintaining process optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the continuous and automatic manufacturing of composite boards with improved productivity and reduced defects by synchronizing the pre-bonding and hot-pressing processes, ensuring efficient transfer and processing of composite boards.
Implementation Method 1
a hot-press device for hot-pressing a first composite board in which a coverlay is pre-bonded onto a printed circuit board
Data Source
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AI summary
The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates.