Composite Substrate Recesses Prevent Resin Breakage

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Solution Overview

Problem

The existing lead frames used in manufacturing light emitting devices are prone to breakage due to bending forces or impacts during the cutting and handling processes, which can cause damage to the housing.

Innovation Solution

A composite substrate and light emitting device design featuring a plate-shaped lead frame with support leads and recesses that securely fit into the resin molded body, reducing stress and preventing breakage by distributing forces and enhancing support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a lead frame with support portion is used to manufacture light emitting device, then the housing can be supported during manufacturing, but bending force or impact during cutting, bending, or handling may cause breakage of the housing

Engineering Contradiction:
Improvesupport during manufacturingVSAvoidresistance to breakage
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The support function is segmented from the traditional lead frame structure. Instead of using a continuous lead frame that requires cutting and bending, the patent divides the support function into multiple discrete support leads that are pre-positioned and fitted into recesses of the housing. This segmentation eliminates the harmful cutting and bending operations while maintaining support functionality during manufacturing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces recesses as intermediary structures in the housing that receive and secure the support leads. These recesses act as mediators between the support leads and the housing, providing a secure fit that prevents movement and reduces stress concentration. The recesses with fitted support leads serve as an intermediary support system that protects the housing during manufacturing without requiring damaging operations.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If support portion is removed from housing after manufacturing, then the housing structure is simplified, but the housing becomes vulnerable to breakage during handling

Engineering Contradiction:
Improvehousing structureVSAvoidbreakage resistance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The support leads are preliminarily fitted into the recesses of the housing before the housing is removed from the lead frame. This preliminary action ensures that the housing is securely supported and protected during the critical removal operation and subsequent handling. The support structure is established in advance to prevent breakage, rather than being added or removed afterward.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent creates a simplified support structure by using only the necessary support leads fitted into recesses, eliminating the complex continuous lead frame structure. This copied support function achieves the essential support capability without the complexity and vulnerability of the traditional lead frame, providing both structural simplification and breakage resistance.

Inventive Principle:
Principle #26Copying

3Productivity

If traditional lead frame cutting and bending operations are performed, then the light emitting device can be assembled, but distortion and stress on the resin molded body increases

Engineering Contradiction:
Improveassembly capabilityVSAvoiddistortion control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Instead of the traditional approach where the lead frame is cut and bent to fit the housing, the patent inverts the process: the support leads are pre-formed and fitted into recesses in the housing, and then the housing is removed from the lead frame. This inversion eliminates the cutting and bending operations entirely, preventing distortion and stress on the resin molded body while maintaining assembly capability.

Inventive Principle:
Principle #13The other way round (Inversion)

Data Source

PatentUS9997503B2Composite substrate and light emitting device
Publication Date: 2018.06.12 NICHIA CORP
  • US9997503B2 patent drawing
  • US9997503B2 patent drawing
  • US9997503B2 patent drawing

AI summary

The composite substrate includes: a lead frame including one or more pairs of support leads, each of the one or more pairs of support leads including a first support lead and a second support lead; and one or more packages supported by first and second support leads and including a resin molded body. The resin molded body includes: a first outer side surface; a second outer side surface; a third outer side surface; a fourth outer side surface; a front surface; a first recess; a second recess; a third recess disposed at a bottom surface of the first recess; and a fourth recess disposed at a bottom surface of the second recess. The first support lead is fitted into the first recess and the third recess, and the second support lead is fitted into the second recess and the fourth recess.