Composite Substrate High Resin Interface Peeling Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In substrates for microstrip patch antennas, particularly for millimeter-wave radar applications, there is a challenge in securing adhesive strength between the fluororesin-based substrate and the conductor layer, leading to potential peeling issues due to the use of high filler content, which reduces the adhesive strength and increases the risk of peeling between the substrate and the resin layer.
Innovation Solution
A plate-like composite material is developed with a pore-containing layer made of fluororesin and filler, featuring a high resin content region near the interface with the resin layer, where the resin content is higher than in the remaining region, and pores are lower in content, along with a resin layer bonded to one or both surfaces of the pore-containing layer, optimizing the thickness of these regions to prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin layer is formed between the wiring and substrate to increase adhesive strength, then adhesive strength is improved, but peeling may occur between the substrate and resin layer
Solution Approach 1:
The patent merges the substrate and resin layer by creating a high resin content region at the interface that acts as a transition zone. This gradual transition eliminates the sharp interface between substrate and resin layer, preventing peeling while maintaining adhesive strength, thus resolving the contradiction between adhesion and peeling resistance.
2Quantity of substance
If the pore-containing layer has high filler content to maintain dielectric properties, then specific dielectric constant is maintained, but adhesive strength deteriorates
Solution Approach 1:
The patent applies local quality by creating a spatial gradient in filler content: high filler content in the bulk region to maintain dielectric properties, and low filler content (high resin content) at the interface region to ensure adhesive strength. This resolves the contradiction between maintaining dielectric constant and ensuring adhesion.
Data Source
AI summary
A plate-like composite material in which peeling of a conductor layer and the like serving as wiring is less liable to occur is provided. The plate-like composite material includes: a pore-containing layer, which contains a fluororesin and a filler, and which contains pores; and a resin layer containing a fluororesin bonded to one surface, or each of both surfaces, of the pore-containing layer, wherein the pore-containing layer includes, in a vicinity of an interface with the resin layer, a high resin content region, which contains the fluororesin in a content higher than a content in a remaining region of the pore-containing layer, and which contains the pores in a content lower than a content in the remaining region, and wherein the high resin content region has a thickness starting from the interface of from 0.20 μm to 10 μm.