Composite Substrate Manufacturing via Soluble Polymer Removal
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Solution Overview
Problem
Current manufacturing processes for substrates, such as high-frequency substrates, are complex and unable to efficiently create substrates with a high density of conductive paths due to the need for drilling holes and filling them with conductive materials.
Innovation Solution
A method involving the formation of a first conductive layer on a liquid crystal polymer layer, patterning it, and then covering it with a soluble liquid crystal polymer layer, which is removed to expose the conductive paths, allowing for the addition of a second conductive layer without the need for drilling holes, using a solvent-based coating process and specific polymer formulations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional hole drilling and filling method is used to create conductive paths, then conductive paths can be formed, but the manufacturing process becomes complex and cannot satisfy high density conductive path requirements
Solution Approach 1:
The patent changes the physical state and solubility parameters of the liquid crystal polymer material. By using a soluble liquid crystal polymer that can be dissolved in specific solvents, the manufacturing process transitions from mechanical hole drilling to a chemical dissolution approach, enabling direct formation of high-density conductive paths through coating and patterning processes
Solution Approach 2:
The patent extracts and removes the second liquid crystal polymer layer selectively using a solvent that dissolves only this specific layer. This extraction process creates openings and exposes conductive paths without requiring hole drilling, simplifying the manufacturing process while enabling high-density conductive path formation
2Ease of manufacture
If soluble liquid crystal polymer layer is used to cover patterned conductive layer, then manufacturing process is simplified, but requires precise control of solvent removal and layer dissolution
Solution Approach 1:
The patent applies local quality by making the second liquid crystal polymer layer selectively removable only in specific regions where conductive paths need to be exposed. The solvent is applied locally to dissolve only the necessary portions of the polymer layer, leaving other areas intact, thus achieving precise control over where conductive paths are formed
Solution Approach 2:
The patent introduces a solvent as an intermediary substance that mediates between the second liquid crystal polymer layer and the desired conductive path structure. The solvent acts as a selective dissolving agent that temporarily removes the polymer layer in specific areas, enabling precise patterning of conductive paths without direct mechanical intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, enabling easier adjustment of conductive path density and distribution, reducing complexity and cost by eliminating the need for hole drilling and filling, while maintaining electrical properties through the use of suitable additives and materials.
Implementation Method 1
removing the second liquid crystal polymer layer which is on the patterned first conductive layer
Implementation Method 2
coating a mixture including the soluble liquid crystal polymer and a solvent on the first liquid crystal polymer layer
Implementation Method 3
removing the solvent to form the second liquid crystal polymer layer
Data Source
AI summary
A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.


