Composite Substrate TSV and Cooling Channel Layout for High-Power ICs
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Solution Overview
Problem
High-power-density semiconductor integrated circuits (ICs) generate significant heat that conventional air cooling methods struggle to dissipate effectively, complicating thermal management and electrical connectivity when using through substrate vias (TSVs) for vertical signal routing.
Innovation Solution
A composite substrate structure is formed by bonding multiple substrates with vertically oriented TSVs and perpendicular cooling channels, enabling simultaneous electrical connectivity and convective cooling by routing cooling fluid through these channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air cooling methods are used for high-power-density ICs, then the device structure remains simple, but heat dissipation effectiveness is insufficient
Solution Approach 1:
The substrate is divided into multiple segments with through-substrate vias (TSVs) creating vertical channels. These segmented structures allow cooling fluid to flow through the substrate thickness, creating multiple heat dissipation pathways that significantly improve thermal management compared to conventional air cooling methods.
Solution Approach 2:
The invention transitions from two-dimensional planar cooling to three-dimensional vertical cooling by etching channels through the substrate thickness. This dimensional change enables cooling fluid to access heat-generating components from the backside, dramatically improving heat dissipation effectiveness while maintaining a compact form factor.
2Reliability
If through substrate vias (TSVs) are used for vertical signal routing, then electrical connectivity is improved, but the same material occupied by TSVs cannot be used for effective heat dissipation
Solution Approach 1:
The through-substrate via structures serve dual functions: electrical interconnectivity for signal routing and thermal management for heat dissipation. By designing the TSV channels to extend through the substrate and connect to cooling fluid sources, the same structural elements perform both electrical and thermal functions simultaneously, resolving the contradiction between these two requirements.
Solution Approach 2:
The invention merges the electrical via structure with the thermal cooling channel into a single integrated TSV system. The vertical channels that provide electrical connectivity also serve as conduits for cooling fluid flow, combining two previously separate functions into one unified structure that addresses both electrical interconnectivity and heat dissipation needs.
3Temperature
If multiple substrates are bonded to form composite structure with cooling channels, then heat dissipation and electrical interconnectivity are enhanced, but manufacturing complexity increases
Solution Approach 1:
Cooling channels and TSV structures are formed in substrates before the bonding process. By pre-forming these critical features in individual substrates, the subsequent bonding step becomes simpler and more reliable, as alignment and integration of complex three-dimensional channels are avoided during the bonding process itself.
Solution Approach 2:
The composite substrate system is divided into multiple separate substrate layers, each containing specific cooling channels and TSV structures. This segmentation allows independent fabrication and optimization of each layer before assembly, reducing overall manufacturing complexity compared to attempting to create the entire complex channel network in a single monolithic substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation and electrical interconnectivity, improving the performance of high-power ICs by maximizing TSV density and cooling fluid throughput, thereby increasing operational speed and efficiency.
Implementation Method 1
The one or more channels configured to contain a cooling fluid moved through the one or more channels to dissipate the heat generated by the circuit away from the circuit
Data Source
AI summary
Technical solutions present structures, systems and methods for providing a cold plate for thermal management of circuit dies using cooling channels and through surface vias (TSVs) formed through multiple bonded substrates. A first substrate can include a circuit coupled with first electrical contacts etched in the first substrate and a second substrate can include second electrical contacts etched in the second substrate. A channel can be etched between the second electrical contacts. A third substrate can include third electrical contacts etched to form combined channel enclosed by the first substrate, the second substrate and the third substrate. The circuit can be electrically coupled with the third plurality of electrical contacts via the first electrical contacts and the second electrical contacts and the combined channel is configured to dissipate heat generated by the circuit.