Composite Thermal Material for Heat Dissipation and Storage

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Solution Overview

Problem

Existing composite materials for heat management in electronic equipment face challenges in efficiently dissipating heat due to inadequate distribution of high-heat-conductivity materials, leading to compatibility issues with heat storage capabilities.

Innovation Solution

A composite material is developed with a volume fraction of heat-conductive material between 20% and 100% and latent-heat material particles of 0.1 μm to 40 μm in diameter, forming a sea-island structure to enhance heat dissipation by transporting heat from the conductive material to the latent-heat material for storage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a large amount of heat-conductivity material is added to improve heat dissipation, then heat dissipation performance is improved, but compatibility with heat storage is difficult to ensure

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidcompatibility with heat storage
Core Design Contradiction:
Loss of energyVSAdaptability or versatility

Solution Approach 1:

The patent applies parameter changes by precisely controlling the volume fraction of heat-conductive material within 20-80% and particle diameters within specific ranges (heat-conductive material: 1-50 μm, latent-heat material: 1-100 μm). This optimization ensures sufficient heat dissipation pathways while maintaining adequate heat storage capacity, resolving the contradiction between heat dissipation performance and heat storage compatibility.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material system combining heat-conductive material and latent-heat material in specific proportions. This composite structure enables simultaneous heat dissipation through the conductive material and heat storage through the latent-heat material, achieving both functions without compromising either performance.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If heat-conductivity material is not efficiently distributed, then heat dissipation is insufficient, but adding more material increases volume and reduces heat storage capacity

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidheat storage capacity
Core Design Contradiction:
Loss of energyVSQuantity of substance

Solution Approach 1:

The patent optimizes particle size parameters to improve distribution efficiency. By controlling heat-conductive material particles at 1-50 μm and latent-heat material particles at 1-100 μm, the material achieves efficient heat dissipation with reduced volume fraction requirements, thereby preserving heat storage capacity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a heterogeneous structure where heat-conductive material and latent-heat material are distributed with specific spatial relationships. This local quality differentiation ensures that heat dissipation occurs efficiently at the particle level while maintaining overall heat storage capacity through optimized phase distribution.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves heat dissipation performance by allowing efficient heat transport and storage, reducing temperature increases and extending heat storage capacity beyond conventional limits.

Implementation Method 1

a plurality of particles formed containing a latent-heat material that causes solid-solid phase transition

Methodology Applied
Scientific EffectSolid-solid phase transition: Phase Change

Implementation Method 2

a heat-conductive material having a higher heat conductivity than the latent-heat material

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20250101287A1Material, method for manufacturing material, and electronic device
Publication Date: 2025.03.27 CANON KK
  • US20250101287A1 patent drawing
  • US20250101287A1 patent drawing
  • US20250101287A1 patent drawing

AI summary

A material includes a mixture of a plurality of particles formed containing a latent-heat material that causes solid-solid phase transition and a heat-conductive material having a higher heat conductivity than the latent-heat material. A volume fraction of the heat-conductive material in the material is 20% or more and less than 100%, and an average particle diameter of the particles is 0.1 μm or more and 40 μm or less.