Composite Thermal Interface Structure for Heat Transfer and Tolerance
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Solution Overview
Problem
Conventional thermal interface materials (TIMs) are inadequate for systems requiring mechanical tolerance adjustments between electronic components and system-level heat sinks, as they either have low thermal conductivity or are unsuitable for high heat applications due to their single-compliant or single-stiff material composition.
Innovation Solution
A composite thermal interface structure is developed, comprising a stack of stiff and compliant TIM layers, potentially with shape memory alloy layers, assembled to provide high thermal conductivity and mechanical flexibility, and may be encased in a collapsible structure to accommodate mechanical tolerances and enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional single-compliant or single-stiff thermal interface materials are used, then the structure is simple, but the thermal conductivity is insufficient or the material is unsuitable for high heat applications when mechanical tolerance adjustments are needed
Solution Approach 1:
The patent applies composite materials by combining multiple TIM layers with different properties (compliant and stiff materials) into a single thermal interface structure. This composite approach enables the system to achieve both high thermal conductivity and mechanical flexibility for tolerance adjustments, resolving the contradiction between structure simplicity and thermal reliability.
Solution Approach 2:
The patent segments the thermal interface material into multiple distinct layers, each with specific functions. The compliant layer accommodates mechanical tolerances while the stiff layer provides high thermal conductivity, allowing each segment to optimize its performance without compromising the other.
2Reliability
If conventional TIMs are used with little mechanical tolerance adjustment needed, then thermal conductivity is adequate, but the material cannot accommodate significant mechanical tolerance adjustments
Solution Approach 1:
The composite TIM structure combines compliant materials that provide mechanical flexibility for tolerance adjustments with stiff materials that ensure high thermal conductivity. This allows the system to adapt to mechanical variations while maintaining effective heat transfer.
Solution Approach 2:
Different regions of the thermal interface structure have different local properties: the compliant layer provides local flexibility for tolerance accommodation, while the stiff layer provides local high thermal conductivity for heat transfer, allowing each region to perform its specific function optimally.
3Reliability
If a single stiff TIM layer is used to achieve high thermal conductivity, then heat transfer is efficient, but the structure cannot accommodate mechanical tolerance variations
Solution Approach 1:
The patent uses composite materials where a stiff TIM layer provides high thermal conductivity for efficient heat transfer, while a compliant TIM layer provides mechanical flexibility to accommodate tolerance variations. This composite structure maintains both thermal efficiency and mechanical adaptability.
Solution Approach 2:
The thermal interface is segmented into functionally distinct layers: a stiff layer dedicated to heat conduction and a compliant layer dedicated to mechanical flexibility, allowing each segment to maintain its specialized properties without compromise.
4Adaptability or versatility
If a single compliant TIM layer is used to accommodate mechanical tolerances, then adaptability is high, but thermal conductivity is insufficient for high heat applications
Solution Approach 1:
The composite TIM structure combines a compliant layer that accommodates mechanical tolerances with a stiff layer that provides high thermal conductivity for high heat applications, allowing the system to achieve both adaptability and thermal reliability simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite structure achieves higher thermal conductivity than conventional single-TIM solutions while allowing for mechanical tolerance adjustments, effectively managing heat dissipation in electronic systems with varying mechanical requirements.
Implementation Method 1
A first thermal interface material of the composite thermal interface structure may include a first material having a first thermal conductivity and a second thermal interface material of the composite thermal interface structure may include a second material having a second thermal conductivity greater than the first thermal conductivity
Implementation Method 2
A composite thermal interface structure may include one or more layers of a phase change material
Data Source
AI summary
A thermal interface structure for transferring heat from an electronic component to a system heat sink includes a stack of one or more layers of a stiff thermal interface material and one or more layers of a compliant thermal interface material stacked on and connected to the one or more layers of the compliant thermal interface material. In some embodiments, the thermal interface structure also may include one or more layers of a shape memory alloy and/or a collapsible encasement.