Composite Thermal Interface Layer for Semiconductor Heat Sink Mounting
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Solution Overview
Problem
Existing methods for mounting semiconductor components to heat sinks are costly, require additional process steps, and often occupy significant space, making them inefficient and expensive.
Innovation Solution
A method involving embedding a heat sink in an encapsulation material and forming a composite layer on its surface using a ceramic filler material and a crosslinking plastic material, which is then treated under vacuum to create a matrix composite layer that facilitates easy mounting of the semiconductor component to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting methods are used to attach semiconductor components to heat sinks, then reliable thermal coupling is achieved, but manufacturing cost increases, process complexity increases, and assembly time increases
Solution Approach 1:
The patent combines the heat sink mounting function with the semiconductor package structure by integrating a thermally conductive layer directly onto the package substrate. This merging eliminates the need for separate mounting materials and processes, reducing both complexity and cost while maintaining reliable thermal coupling between the semiconductor component and heat sink
Solution Approach 2:
The thermally conductive layer is formed on the semiconductor package substrate before final assembly, preparing the mounting surface in advance. This preliminary action eliminates the need for additional mounting process steps, reducing assembly time and process complexity while ensuring reliable thermal contact from the outset
2Temperature
If conventional mounting methods are used, then heat dissipation is achieved, but manufacturing cost and assembly effort increase
Solution Approach 1:
The semiconductor package is equipped with an integrated thermally conductive layer that enables self-mounting to heat sinks without requiring additional mounting materials or complex assembly procedures. This self-service approach simplifies manufacturing while maintaining effective heat dissipation, as the package itself provides the necessary thermal interface
3Reliability
If additional mounting components and processes are used, then reliable thermal connection is achieved, but production time and cost increase
Solution Approach 1:
The patent extracts the mounting function from separate external components and integrates it directly into the semiconductor package structure through the thermally conductive layer. This extraction eliminates the need for additional mounting components and processes, streamlining production and improving assembly productivity while maintaining reliable thermal connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs and simplifies the mounting process by providing a pre-formed thermally conductive layer on the semiconductor component, allowing for efficient heat dissipation and easy integration with a heat sink without the need for additional assembly steps.
Implementation Method 1
performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface
Data Source
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AI summary
A method for forming a composite layer on a workpiece is disclosed. In an embodiment, the method comprises forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface of a workpiece, depositing a filler material in a walled area on the metallic surface, depositing a plastic material on the filler material, and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.