Composite Thermoelectric Material for Electronics Enclosure Thermal Management
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Solution Overview
Problem
Conventional electronics enclosures lack efficient and lightweight thermal management solutions that can provide reliable temperature control without moving parts, and often require separate cooling systems, which increase weight and complexity.
Innovation Solution
Incorporating a composite thermoelectric material comprising fibrous thermoelectric layers, thermally and electrically conductive meshes, and structural reinforcement materials embedded in a matrix, which enables active cooling and heating while providing electromagnetic interference protection and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronics enclosures use separate cooling systems, then reliable temperature control is achieved, but weight increases and system complexity increases
Solution Approach 1:
The patent combines the cooling function with the enclosure structure by integrating thermoelectric material directly into the enclosure walls. This merging eliminates the need for separate cooling systems while maintaining temperature control reliability, thereby reducing weight and system complexity.
Solution Approach 2:
The enclosure structure is designed to perform multiple functions: it provides structural containment, thermal management through integrated thermoelectric material, and EMI shielding through conductive mesh. This multi-functionality eliminates the need for separate dedicated cooling components, reducing overall system weight.
2Reliability
If conventional electronics enclosures use separate cooling systems, then temperature control is achieved, but device complexity increases
Solution Approach 1:
The cooling function is merged into the enclosure wall structure itself through integration of thermoelectric material. This eliminates multiple separate cooling components, connections, and control systems, thereby reducing device complexity while maintaining reliable temperature control.
Solution Approach 2:
The patent replaces mechanical cooling systems (such as fans, heat sinks, and thermal pipes) with solid-state thermoelectric material that provides active cooling through the Peltier effect. This substitution eliminates moving parts and mechanical complexity while maintaining effective temperature control.
3Object-affected harmful factors
If thermally and electrically conductive mesh is added for EMI protection, then EMI protection is improved, but manufacturing complexity increases
Solution Approach 1:
The EMI shielding function is merged into the enclosure structure by integrating conductive mesh directly into the wall assembly during manufacturing. This simultaneous integration of multiple functions (structural support, thermal conduction, electrical conduction, and EMI shielding) reduces the number of separate manufacturing steps and assemblies required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat transfer and temperature control within electronics enclosures, reducing weight and eliminating the need for separate cooling systems, while offering reliable thermal management and EMI protection without moving parts.
Implementation Method 1
a fibrous thermoelectric material... configured to convert electrical energy to thermal energy to enable active cooling and heating
Implementation Method 2
The thermally and electrically conductive mesh may additionally provide electromagnetic interference (EMI) protection for electronic components enclosed in the internal volume of the electronics enclosure
Data Source
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AI summary
An electronics enclosure (92) may include a fibrous thermoelectric material (16); a thermally and electrically conductive mesh (14,18); and a matrix material in which the fibrous thermoelectric material and the thermally and electrically conductive mesh (14,18) are embedded.