Composite VPX Connector for 25 Gbps High Speed Interconnect

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Solution Overview

Problem

Conventional VPX connectors face challenges in supporting 25 Gbps data rates with Bit Error Rates (BER) of 1E-15 or better due to crosstalk issues in the via field, limiting their performance in high-speed communication applications, especially in avionics and military environments.

Innovation Solution

The solution involves a novel refinement to VPX connector pins and a Printed Wiring Board (PWB) structure using Double Transition (DT) vias, which reduce cross-talk while maintaining the connectors' ability to withstand harsh environments, and a connector architecture with short pins soldered into structured blind vias, combined with a buried via to minimize parasitic capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If conventional VPX connectors are used, then the connector structure is simple and easy to manufacture, but the data rate is limited to 16 Gbps with high crosstalk preventing 25 Gbps operation

Engineering Contradiction:

Improvedata rateVSAvoidconnector structure

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The connector is divided into multiple separate high-speed electrical connectors that are serially arranged and coupled together to form a composite connector. This segmentation allows each individual connector to be optimized for high-speed performance while the composite structure achieves the required data rates above 25 Gbps by distributing the signal paths across multiple controlled-impedance connections.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-plane connector design to a three-dimensional composite structure where multiple connectors are arranged in series and coupled through various mounting methods (soldering, mechanical attachment, adhesive bonding). This dimensional change enables complex signal routing with proper impedance control while maintaining compatibility with standard PWB via structures.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Speed

If multiple high-speed electrical connectors are coupled together to form a composite connector, then the data rate capability increases to above 25 Gbps, but the manufacturing complexity and assembly difficulty increase

Engineering Contradiction:

Improvedata rateVSAvoidassembly process

Core Design Contradiction:

SpeedVSEase of manufacture

Solution Approach 1:

Multiple high-speed electrical connectors are pre-coupled together to form an integrated composite connector assembly before being mounted to the PWB. This preliminary assembly allows for optimized alignment and coupling methods (soldering, mechanical attachment, or adhesive bonding) to be applied during manufacturing, simplifying the final installation process while maintaining the complex internal structure needed for 25+ Gbps performance.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs intermediary coupling methods between the individual connectors in the composite structure, including soldering, mechanical attachment elements, and adhesive bonding. These intermediaries provide flexible manufacturing options that balance assembly ease with the structural integrity required for high-speed signal integrity above 25 Gbps.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Speed

If conventional via structures are used, then the via field provides mechanical support, but crosstalk in the via field limits performance at 25 Gbps and above

Engineering Contradiction:

Improvedata rateVSAvoidcrosstalk

Core Design Contradiction:

SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent implements local quality optimization by creating controlled-impedance signal paths through carefully designed via structures and trace geometries in the PWB. Each signal path is locally optimized with appropriate via spacing, via diameter, and trace width to maintain characteristic impedance and minimize crosstalk, enabling 25+ Gbps data rates despite the presence of via fields for mechanical support.

Inventive Principle:

Principle #3Local quality

4Extent of automation

If the top surface of the composite connector is rough or uneven, then the connector can be mechanically robust, but automated placement becomes difficult

Engineering Contradiction:

Improveautomated placementVSAvoidmechanical robustness

Core Design Contradiction:

Extent of automationVSStrength

Solution Approach 1:

A planarization layer or smoothing intermediary is applied to the top surface of the composite connector assembly. This intermediary layer provides a smooth, planar surface that is compatible with automated placement equipment while the underlying mechanical structure maintains its robustness and structural integrity for withstanding harsh environments.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11283204B1Systems and methods for providing a composite connector for high speed interconnect systems

Publication Date: 2022.03.22 EAGLE TECHNOLOGY LLC

AI summary

Systems and methods for simultaneously coupling a plurality of high speed electrical connectors to a Printed Wiring Board (“PWB”). The methods comprise: obtaining a composite electrical connector comprising the plurality of high speed electrical connectors which are serially arranged in a side-by-side manner and coupled to each other; automatedly engaging a smooth surface of the composite electrical connector; placing the composite electrical connector on the PWB so that pins of the plurality of high speed electrical connectors are concurrently inserted into vias formed in the PWB; and coupling the composite electrical connector to the PWB by soldering the pins in the vias.