Composite water-cooling radiator structure
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Solution Overview
Problem
Conventional water-cooling radiators require a large mounting space due to their volume, leading to reduced heat dissipation efficiency and potential damage from heat accumulation in electronic devices, especially for high-workload components like CPUs and GPUs.
Innovation Solution
A composite water-cooling radiator structure comprising three superposed layers: a cooling plate, a cooling chip unit, and a vapor chamber, optionally with radiation fin assemblies, designed to minimize thermal resistance and enhance heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional water-cooling radiator is designed with a large volume, then heat dissipation efficiency is improved, but mounting space requirement increases
Solution Approach 1:
The patent implements a nested structure where the water-cooling radiator is integrated within the housing of the electronic device, and the radiation fins are arranged in a compact configuration. The cooling liquid flow channels are nested within the radiator body, allowing maximum heat dissipation surface area within minimal mounting space, thus resolving the contradiction between heat dissipation efficiency and space requirement.
Solution Approach 2:
The patent transitions from a conventional two-dimensional flat radiator design to a three-dimensional multi-layered structure with radiation fins extending in multiple directions. This dimensional change allows the radiator to achieve greater heat dissipation surface area within a compact volume, effectively improving heat dissipation efficiency without proportionally increasing mounting space.
2Productivity
If the working liquid flows quickly through straight flat pipes, then cooling efficiency is improved, but thermal resistance increases
Solution Approach 1:
The patent replaces straight flat pipes with curved or serpentine flow channels that follow a winding path through the radiator. This curved configuration increases the contact area between the working liquid and the radiator channels, enhancing heat transfer efficiency while reducing thermal resistance, thereby improving cooling efficiency without energy loss.
3Reliability
If radiation fins are added to increase air contact area, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates the radiation fins directly into the housing structure of the electronic device, merging the heat dissipation function with the structural enclosure. This integration allows the radiation fins to perform dual functions: providing structural support and enabling heat dissipation, thereby improving heat dissipation efficiency without proportionally increasing device complexity.
Solution Approach 2:
The housing structure is designed to serve multiple functions: it provides mechanical protection, structural support, and heat dissipation through integrated radiation fins. This multi-functionality approach allows the same structural elements to perform multiple roles, reducing the need for additional dedicated heat dissipation components and thereby controlling device complexity while improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves compact design with upgraded heat dissipation efficiency by efficiently transferring heat from the cooling plate to the vapor chamber and increasing air contact area, reducing thermal resistance and preventing heat concentration, thus improving the reliability and performance of electronic devices.
Implementation Method 1
heat absorbed and carried by the working liquid is transferred to and dissipated from the water-cooling radiator into ambient air
Implementation Method 2
The pump 1a drives the cooling liquid to continuously circulate between the water-cooling radiator 1 and the water block 1b
Implementation Method 3
heat is transferred from the cooling plate via the cooling chip unit to the vapor chamber
Data Source
AI summary
A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.