Composite Wick Vapor Chamber with Gas-Liquid Separation Plate

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional vapor chambers are inadequate for modern heat dissipation due to their wick arrangement, which limits heat transfer performance in compact electronic devices.

Innovation Solution

A heat dissipation device with a composite wick structure and a gas-liquid separation plate is designed, featuring multiple wicks and supporting structures to enhance heat transfer efficiency, where the gas-liquid separation plates improve wettability and reduce droplet splashes, allowing for efficient two-phase flow circulation and increased heat transfer performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional wick arrangement is used in vapor chamber, then device structure is simple, but heat transfer performance is insufficient for modern high-power applications

Engineering Contradiction:
Improveheat transfer performanceVSAvoidwick structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The wick structure is segmented into multiple independent wicks (first wick, second wick, third wick) positioned at different locations within the vapor chamber. Each wick independently performs capillary transport functions, collectively enhancing heat transfer performance while maintaining manageable structural complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different wicks are positioned at specific locations with different functional requirements: first wick at evaporation area, second wick at condensation area, third wick at transportation area. Each wick is optimized for its local function, creating non-uniform local quality that improves overall heat transfer performance

Inventive Principle:
Principle #3Local quality

2Productivity

If vapor and liquid are allowed to mix freely in transportation area, then device structure is simple, but vapor and liquid interfere with each other reducing heat transfer efficiency

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidseparation structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The gas-liquid separation plate extracts and removes vapor from the transportation area, separating it from the liquid return path. This extraction prevents vapor-liquid interference and improves heat transfer efficiency by ensuring only liquid returns to the evaporation area through the wicks

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The gas-liquid separation plate acts as an intermediary component between the vapor phase and liquid phase. It mediates their interaction by allowing vapor to pass through while blocking liquid, enabling efficient phase separation without complex mechanical moving parts

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If wick material does not have sufficient wettability, then device structure is simple, but droplet splashes increase and heat transfer performance decreases

Engineering Contradiction:
Improveheat transfer performanceVSAvoidmaterial selection complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The wick material parameters are changed to achieve high wettability, specifically selecting materials with contact angle less than 90 degrees. This parameter change reduces droplet splashing and improves capillary action, enhancing heat transfer performance through optimized material properties rather than structural complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves a significant increase in heat transfer performance by ensuring quick and full involvement of the working fluid in the heat transfer circulation, reducing resistance, and preventing interference between vapor and liquid, thereby enhancing evaporation speed and heat flux despite limited internal space.

Implementation Method 1

transported back through the wick structure via capillary action

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

the absorbed heat is transfer to the other side through the phase change of liquid to vapor

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

as the vapor touches the cooled wick, it is condensed into liquid

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentUS11754345B2Heat dissipation device
Publication Date: 2023.09.12 VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
  • US11754345B2 patent drawing
  • US11754345B2 patent drawing
  • US11754345B2 patent drawing

AI summary

A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation plate. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation plate is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.