Composite Wiring Substrate for Inspection Apparatus
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Solution Overview
Problem
Existing wiring substrates for inspection apparatus face challenges in achieving high-precision electrically conductive paths and stable impedance matching due to the use of insulating materials like ceramic, which results in thick conductive paths and difficulty in maintaining narrow spacing, leading to unstable impedance and potential inspection failures.
Innovation Solution
A wiring substrate design comprising a base substrate with ceramic and resin layers, where the ceramic substrate section provides strength and the resin layers allow for thin, accurately spaced inner wiring, enabling stable impedance matching and precise electrical connections between probe pads and terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ceramic substrate is used for tile substrate, then strength and structural stability are improved, but manufacturing precision of electrically conductive paths deteriorates due to thick paths and difficulty in maintaining narrow spacing
Solution Approach 1:
The patent employs a composite substrate structure combining ceramic and resin layers. The ceramic layer provides structural strength and stability, while the resin layer enables precise formation of electrically conductive paths with narrow spacing. This composite approach resolves the contradiction by assigning different functional requirements to different materials within the same substrate.
Solution Approach 2:
The substrate is segmented into distinct ceramic and resin portions, each optimized for specific functions. The ceramic portion handles mechanical support requirements, while the resin portion handles high-precision electrical interconnection requirements. This segmentation allows each material to excel at its designated function without compromise.
2Stability of the object's composition
If ceramic substrate is used for tile substrate, then structural stability is improved, but impedance matching stability deteriorates due to unstable impedance from thick conductive paths
Solution Approach 1:
The composite ceramic-resin substrate structure enables stable impedance matching by using the resin layer to form thin, precisely controlled conductive paths. The resin material properties allow for consistent impedance characteristics, while the ceramic layer maintains structural stability. This resolves the contradiction between structural stability and impedance matching stability.
3Strength
If firing shrinkage is considered in ceramic substrate, then structural integrity is maintained, but spacing between surface pads increases, reducing manufacturing precision
Solution Approach 1:
The substrate is divided into ceramic and resin sections with distinct fabrication processes. The resin section is processed without firing shrinkage concerns, allowing precise pad spacing to be achieved. The ceramic section maintains structural integrity through its own firing process. This segmentation eliminates the compromise between structural integrity and precise spacing.
4Productivity
If tile substrate size is reduced, then productivity and inspection efficiency are improved, but manufacturing precision of electrically conductive paths deteriorates without proper substrate material selection
Solution Approach 1:
The composite ceramic-resin substrate enables reduced tile substrate size while maintaining high manufacturing precision of electrically conductive paths. The resin layer's ability to form thin, accurately spaced conductive paths is preserved even in smaller substrates, allowing high-density interconnection elements and improved inspection efficiency without sacrificing precision.
Data Source
AI summary
A wiring substrate for inspection apparatus includes a base substrate and a plurality of tile substrates. The tile substrate is composed of a ceramic substrate section and a first resin substrate section. Each ceramic substrate section is composed of a plurality of ceramic layers and has a plurality of upper-surface connection terminals provided on an upper surface thereof, a plurality of lower-surface connection terminals provided on a lower surface thereof, and a plurality of through conductors for conducting electricity between the upper-surface connection terminals and the lower-surface connection terminals. The first resin substrate section is laminated on the upper surface and includes a laminate of a plurality of resin layers, a plurality of probe pads formed on a resin front-surface thereof, a plurality of inner wiring layers formed between the resin layers, and a plurality of electrically conductive paths for conducting electricity between the probe pads and the upper-surface connection terminals.