Composite Wood Article Using Recycled CMP Polishing Pad Debris
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased material waste and environmental issues due to the disposal of polishing pad debris from chemical mechanical planarization (CMP) processes, necessitating improved recycling and processing methods.
Innovation Solution
A method involving the collection and recycling of polishing pad debris by combining it with wood material to form a composite article, which is then assembled into a pallet, reducing waste and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If polishing pad debris is disposed of through conventional methods, then the manufacturing process is simple, but material waste increases and environmental problems occur
Solution Approach 1:
The patent applies the discarding and recovering principle by collecting polishing pad debris that would normally be discarded and transforming it into a useful composite material. The debris is gathered from the CMP process, combined with wood fibers and binding agents, and processed into composite articles that can be used for various applications, thereby recovering value from what would otherwise be waste material.
Solution Approach 2:
The patent converts the harmful aspect of polishing pad debris (waste material causing environmental problems) into a beneficial product (composite material). By transforming the debris into a reusable composite article, the patent eliminates the environmental harm while creating a valuable resource, effectively turning a waste management problem into a sustainable manufacturing solution.
2Loss of substance
If polishing pad debris is recycled by combining with wood material, then material wastage is reduced, but the processing complexity increases
Solution Approach 1:
The patent applies the composite materials principle by combining polishing pad debris with wood fibers and binding agents to create a new composite material. This composite article integrates different materials (polishing pad debris, wood, binding agent) to form a unified product with useful properties, thereby giving value to the waste debris while creating a functional material for various applications.
3Ease of manufacture
If conventional disposal methods are used, then processing is simple, but environmental harm increases
Solution Approach 1:
The patent converts the harmful aspect of polishing pad debris (waste material causing environmental problems) into a beneficial product (composite material). By transforming the debris into a reusable composite article, the patent eliminates the environmental harm while creating a valuable resource, effectively turning a waste management problem into a sustainable manufacturing solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively recycles polishing pad debris, reducing material wastage and environmental problems associated with its disposal, while enabling the reuse of materials in semiconductor manufacturing.
Implementation Method 1
rubbing a polishing pad to remove a portion of the polishing pad
Data Source
AI summary
A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.