Composite Word Line Structure for Lower Memory Array Resistance

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Solution Overview

Problem

Current memory array architectures face limitations due to high word line resistance, which restricts die area efficiency and requires frequent word line chopping and staircases, making it difficult to achieve desired die size reductions.

Innovation Solution

The use of word lines comprising a first material with a first resistivity and a second material with lower resistivity placed along the edge of the first material, reducing total resistance and enabling extended word line lengths and reduced die size scaling by eliminating staircase and block separation areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If word lines are made longer to reduce die size, then die area efficiency improves, but word line resistance increases

Engineering Contradiction:
Improvedie areaVSAvoidword line resistance
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The word line is constructed as a composite structure with a first material (e.g., polysilicon) forming the main body and a second material (e.g., metal) filling recesses at edges or corners. This composite configuration combines the high breakdown voltage advantage of polysilicon with the low resistance advantage of metal, enabling longer word line lengths while maintaining acceptable resistance levels and allowing die size reduction without proportionally increasing resistance.

Inventive Principle:
Principle #40Composite materials

2Reliability

If word line resistance is reduced by using lower resistivity materials, then word line performance improves, but die area increases due to additional structures

Engineering Contradiction:
Improveword line resistanceVSAvoiddie area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

Instead of uniformly replacing the entire word line with low-resistivity material, the invention applies the second material locally at specific positions such as edges or corners where resistance contribution is most significant. This localized approach reduces overall word line resistance while minimizing the additional die area required, as the low-resistivity material is confined to specific regions rather than occupying the entire word line structure.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3869510B1Resistance reduction for word lines in memory arrays
Publication Date: 2023.12.20 INTEL NDTM US LLC
  • EP3869510B1 patent drawingFigure 1(a)~1(b)
  • EP3869510B1 patent drawingFigure 1(c)~1(d)
  • EP3869510B1 patent drawingFigure 2(a)~2(d)

AI summary

Apparatus, systems, or methods for a memory array having a plurality of word lines. A word line includes at least one word line plate, and the word line plate comprises a first material with a first resistivity. An edge of the word line plate is recessed and filled with a second material having a second resistivity that is lower than the first resistivity. As a result, the total resistance of the word line may be reduced compared to a word line using only the first material with the first resistivity. Other embodiments may also be described and claimed.