Compound Circuit Board for Automotive Radar Integration
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Solution Overview
Problem
Conventional automotive radar systems face challenges in reducing the volume and thickness due to the limited space within vehicle bumpers and the need for multiple circuit boards connected by board-to-board connectors, which increases complexity and thickness.
Innovation Solution
A compound circuit board is introduced, comprising two substrates with different trace layers and a prepreg layer in between, allowing for a single board to integrate digital signal processing, electronic control, and RF modules, reducing thickness and eliminating the need for connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple circuit boards (DSP board, ECU board, RF antenna board) are used to implement different portions of the radar system, then the functional requirements are met, but the overall volume and thickness increase significantly due to the need for board-to-board connectors
Solution Approach 1:
The patent combines the DSP board, ECU board, and RF antenna board into a single integrated circuit board. The digital signal processing unit, electronic control unit, and antenna module are all mounted on the same substrate, eliminating the need for multiple separate boards and board-to-board connectors, thereby significantly reducing the overall volume of the radar system.
Solution Approach 2:
The single circuit board is designed to perform multiple functions simultaneously. It houses both digital signal processing circuits and RF antenna elements, allowing one board to replace what previously required three separate boards, thus achieving multi-functionality in a compact form factor.
2Adaptability or versatility
If board-to-board connectors are added to connect multiple circuit boards, then the radar system can function with separate modules, but the thickness of the end-product increases to more than 10 mm
Solution Approach 1:
The patent merges multiple circuit boards into a single integrated board structure. By placing the digital signal processing unit and antenna module on the same substrate, the design eliminates the need for board-to-board connectors, thereby reducing the thickness from more than 10 mm to less than 5 mm.
3Ease of operation
If the thickness of individual circuit boards is kept less than 2 mm, then the board flexibility and ease of installation are improved, but the total thickness exceeds 10 mm when connectors are added
Solution Approach 1:
The patent combines multiple thin circuit boards into a single integrated board that maintains the thin profile. By integrating the DSP unit and antenna module on one substrate rather than stacking multiple boards with connectors, the total thickness remains under 5 mm while preserving the flexibility advantages of thin-board construction.
4Ease of manufacture
If conventional separate board architecture is used, then each board can be optimized for its specific function, but the assembly complexity and volume increase
Solution Approach 1:
The patent merges multiple functionally-optimized boards into a single integrated circuit board. The substrate incorporates both digital signal processing circuits and RF antenna elements, eliminating the need for complex multi-board assemblies and board-to-board connectors, thereby reducing assembly complexity while maintaining functional optimization.
Data Source
AI summary
A compound circuit board for a radar device includes a first substrate including a plurality of trace layers having a first trace layer formed with a digital signal processing unit and an electronic control unit in a first area, a second substrate including a plurality of trace layers having a second trace layer formed with an antenna module in a second area, and a prepreg layer between the first and second substrates for connecting the first and second substrates, wherein the first area and the second area in a first projecting result generated by projecting the first trace layer on the second trace layer are substantially overlapped.