Compound Gas Jet for Fluidic Levitation in ALD
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Solution Overview
Problem
Existing substrate processing methods using fluidic levitation face challenges with positional stability and contamination due to lateral movement and reactivity issues, particularly when handling chemically reactive materials, leading to equipment failure and substrate defects.
Innovation Solution
The use of a pressurized compound fluid flow with an inert fluid surrounding a reactive fluid to fluidically levitate the substrate, employing Bernoulli effects to stabilize the substrate's position and prevent unwanted reactions during atomic layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fluidic levitation is used to prevent substrate contact and contamination, then substrate purity is improved, but lateral movement and positional instability occur causing deposition defects
Solution Approach 1:
A compound gas jet consisting of an inner reactive gas flow and an outer inert gas flow is introduced as an intermediary system. The inert outer flow acts as a mediator that stabilizes the substrate position through Bernoulli effects while the reactive inner flow performs the deposition function, thus preventing direct contact between the reactive gas and chamber surfaces while maintaining substrate stability
Solution Approach 2:
The patent changes the physical parameters of the gas flow system by creating a compound jet structure with different gas types and flow rates. By adjusting the inert gas flow rate to be higher than the reactive gas flow rate, the system exploits Bernoulli pressure effects to create a stable low-pressure region that anchors the substrate in position, thereby improving positional stability without sacrificing deposition effectiveness
2Manufacturing precision
If chemically reactive materials are used for deposition, then film quality is improved, but unwanted reactions on chamber surfaces occur leading to equipment failure
Solution Approach 1:
The inert gas flow serves as a protective intermediary that surrounds the reactive gas jet. This intermediary layer prevents the reactive deposition materials from contacting the chamber surfaces directly, thereby eliminating unwanted side reactions and equipment contamination while allowing the reactive gas to perform its intended deposition function on the substrate
Solution Approach 2:
The patent creates a localized inert atmosphere using the outer gas flow that envelops the reactive inner gas flow. This inert environment protects the chamber surfaces from reactive materials during the deposition process, preventing harmful reactions and equipment failure while maintaining the effectiveness of the reactive deposition on the substrate
3Productivity
If conventional gas delivery methods are used, then equipment complexity is reduced, but gas dispersion is slow and non-uniform causing deposition inefficiency
Solution Approach 1:
The gas delivery system is segmented into two distinct functional components: an inner nozzle for reactive gas delivery and an outer nozzle for inert gas delivery. This segmentation allows each gas flow to perform its specific function independently - the reactive gas for deposition and the inert gas for stabilization and protection - thereby achieving fast and uniform gas dispersion without excessive system complexity
Solution Approach 2:
The patent merges two gas delivery functions into a single integrated compound jet structure. By combining the reactive and inert gas flows in a coaxial arrangement, the system achieves both fast deposition (from the reactive gas) and stable uniform dispersion (from the inert gas) simultaneously, improving productivity without requiring separate complex delivery systems
Data Source
AI summary
A method for depositing a thin film on a substrate using atmospheric pressure atomic-layer deposition includes providing a chamber having an atmosphere and a stationary support located in the chamber. The moveable substrate is located in a spatial relationship with the stationary support. A pressurized compound fluid flow, including an inert fluid surrounding a reactive fluid, is provided simultaneously through the stationary support that impinges on at least a portion of the moveable substrate to fluidically levitate the moveable substrate and expose the moveable substrate to the compound fluid flow to deposit a thin film on the moveable substrate.