Compound Micro-Assembly of Pixel Modules for Large Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flat-panel display technologies face challenges such as increased complexity, limited display format, high manufacturing costs, and reduced manufacturing yields due to the use of LEDs, which require complex wiring and rigid substrates, limiting their integration in larger displays.
Innovation Solution
The compound micro-assembly process involves forming micro-systems, such as red, green, and blue micro LEDs, on an intermediate substrate using micro-transfer printing, allowing for fine lithography and testing before assembly onto a destination substrate, reducing assembly costs and improving yield through the use of flexible materials like glass or plastic.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If LEDs are integrated in larger displays, then display size is improved, but device complexity increases due to complex wiring to each individual LED
Solution Approach 1:
The patent segments the display into modular pixel units, where each pixel is a self-contained module with integrated LED elements and control circuitry. This segmentation allows pixels to be manufactured independently and assembled in arrays, reducing the overall wiring complexity by localizing connections within each pixel module rather than requiring individual wiring to every LED across the entire display.
Solution Approach 2:
The patent merges the LED light-emitting elements with the control circuitry into integrated pixel modules. By combining these functions into unified units, the patent eliminates the need for separate wiring to each individual LED, as the control circuitry is embedded within the same module, thereby reducing device complexity while enabling larger display areas.
2Manufacturing precision
If rigid substrates are used for LED manufacturing, then manufacturing precision is improved, but adaptability is reduced due to inability to use flexible materials
Solution Approach 1:
The patent applies preliminary action by fabricating complete functional pixel modules on rigid substrates with high manufacturing precision, then transferring these pre-assembled modules to flexible display substrates. This approach allows the benefits of rigid substrate manufacturing precision to be preserved while achieving the adaptability of flexible materials in the final display configuration.
Solution Approach 2:
The patent uses an intermediary transfer process that enables the decoupling of manufacturing from final application. The rigid substrate serves as an intermediary manufacturing platform that allows precise fabrication, while the flexible substrate serves as the final adaptable platform. The transfer mechanism acts as an intermediary that bridges these two requirements, allowing high-precision manufacturing on rigid substrates to be transferred to flexible substrates for the final display.
3Ease of manufacture
If conventional assembly methods are used, then manufacturing process is simplified, but manufacturing yield is reduced
Solution Approach 1:
The patent segments the manufacturing process into independent pixel module fabrication and subsequent array assembly stages. This segmentation allows each pixel module to be manufactured and tested independently, improving manufacturing yield by identifying and replacing defective modules without affecting the entire display. The modular approach maintains ease of manufacture through standardized assembly processes while significantly improving overall yield.
Solution Approach 2:
The patent incorporates feedback mechanisms by implementing functional testing of individual pixel modules during the assembly process. Defective modules are identified through testing and can be replaced before final display assembly, thereby improving manufacturing yield. The feedback from testing results guides the replacement process, ensuring that only functional modules are assembled into the final display array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables low-cost manufacturing with improved reliability and yield by allowing for fine lithography on a smaller area, enabling functional testing of pixels, and reducing input/output lines, resulting in improved transparency and performance.
Implementation Method 1
micro-transfer printing
Data Source
Figure 1
Figure 2A~2D
Figure 3
AI summary
The disclosed technology relates generally to designs and methods of assembling devices utilizing compound micro-assembly. Functional elements are micro-assembled to form an array of individual micro-systems on an intermediate substrate, then the microsystems are transferred (one or more at a time) to a destination or device substrate. For example, for a display device, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit. An array of pixels may be formed by micro-transfer printing functional elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.