Integrated Compound Semiconductor Co-Packaged Optics for Signal Integrity
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Solution Overview
Problem
Traditional optical semiconductors face limitations in efficiently transporting high-capacity electronic data traffic due to signal loss and integrity issues in inter-substrate connections, particularly when ASICs and optical components are housed on separate substrates.
Innovation Solution
The integrated compound semiconductor co-packaged optics (CCPO) design co-packages an electronic hyper-scale integrated circuit device (HSIC) with optical components on a common substrate, utilizing indium phosphide (InP) or gallium arsenide (GaAs) substrates, incorporating modulators, amplifiers, and photodetectors to enhance data transmission, with optional cooling and amplification, and employs embedded light couplers and waveguides for efficient light coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If ASICs and optical components are housed on separate substrates, then device flexibility and modularity are improved, but signal loss and integrity issues occur in inter-substrate connections
Solution Approach 1:
The patent merges ASICs and optical components onto a single substrate, eliminating inter-substrate connections. This integration approach directly resolves the signal integrity issues caused by separate substrates while maintaining design flexibility through modular component placement on the unified substrate.
2Reliability
If components are integrated on a single substrate, then signal loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the integrated substrate into distinct functional regions for ASICs and optical components, with dedicated input/output interfaces. This segmentation simplifies manufacturing by allowing independent optimization of each component type while maintaining their integrated benefits for reducing signal loss.
3Device complexity
If traditional optical semiconductors are used, then device simplicity is maintained, but data transmission capacity is limited
Solution Approach 1:
The patent employs compound semiconductor materials (such as InP or GaAs) that combine electronic and optical properties in a single material system. This composite approach enables high-capacity data transmission through integrated modulators and photodetectors while maintaining relative device simplicity through unified material chemistry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces signal loss, improves data transmission speed and energy efficiency, and enhances thermal management by integrating components on a single substrate, supporting high-capacity data transmission in hyperscale data centers.
Implementation Method 1
incorporating modulators, amplifiers, and photodetectors to enhance data transmission
Implementation Method 2
employs embedded light couplers and waveguides for efficient light coupling
Implementation Method 3
with optional cooling and amplification
Data Source
AI summary
This disclosure describes an integrated compound semiconductor co-packaged optics (CCPO) device. The CCPO device has a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC) mounted on a common package substrate. The PIC has a modulator array and a photodetector (PD) array fabricated in GaAs and/or InP. In some configurations the PIC also has an amplifier array fabricated in GaAs and/or InP. The CCPO design reduces loss and signal integrity issues that are typically present when the PIC and EIC are on separate substrates.