Compressed AC Capacitor Contact Interface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High voltage high frequency AC power capacitors experience significant Ohmic, dielectric, and inductive energy losses in the form of heat due to thermal junctions created by soldering, which limits their efficiency and makes it difficult to assemble capacitors in series without damaging the dielectric components.
Innovation Solution
A capacitor design that uses a housing to apply compressive force to bind the capacitor body and electrodes together, eliminating the need for soldering and reducing thermal junctions by maintaining uniform electrical and thermal conductive contact through a large, parallel contact plane, thereby negating the requirement for intermediate bonding materials and soldered contact points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to attach electrodes to capacitor body, then electrical connection is achieved, but thermal junctions are created causing energy losses and heat generation
Solution Approach 1:
The patent removes the soldering process entirely from the capacitor assembly. Instead of using solder to create electrical connections between the capacitor body and electrodes, the invention uses direct mechanical contact through compressed contact surfaces, thereby eliminating the thermal junctions and associated energy losses that occur with soldered connections.
Solution Approach 2:
The patent introduces a conductive adhesive or bonding material as an intermediary substance between the capacitor body and electrodes. This bonding material provides both mechanical attachment and electrical conduction without creating the high-resistance thermal junctions characteristic of soldering, thus reducing energy losses while maintaining reliable electrical connection.
2Strength
If soldering temperature is increased to ensure solid attachment, then connection strength is improved, but dielectric components may melt or disintegrate
Solution Approach 1:
The patent replaces the thermal-mechanical soldering process with a purely mechanical compression system. A housing applies compressive force to press the electrode contact surfaces against the capacitor body contact surfaces, creating strong mechanical attachment without the need for high temperatures that could damage dielectric components.
Solution Approach 2:
The patent changes the bonding mechanism from thermal (soldering at high temperature) to mechanical (compression at room or moderate temperature). By applying compressive force through the housing, the system achieves strong connections without exposing the dielectric components to temperatures that would cause melting or disintegration.
3Ease of manufacture
If intermediate bonding materials are added to connect aluminum capacitor body to copper electrode, then bonding is achieved, but additional interfaces and thermal junctions are created
Solution Approach 1:
The patent merges the functions of mechanical bonding and electrical conduction into a single integrated system. The compressive housing simultaneously provides mechanical attachment and ensures electrical contact between the capacitor body and electrodes, eliminating the need for separate intermediate bonding materials and reducing the number of interfaces to a minimum.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces energy losses and heat generation, enhancing the efficiency of the capacitors and allowing for the assembly of capacitors in series without damaging the dielectric components, thus improving the overall performance and reliability of high voltage power capacitors.
Implementation Method 1
a housing operative to apply compressive force operative to bind the capacitor body contact surface and the electrodes contact surface together
Implementation Method 2
maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface
Implementation Method 3
maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C
AI summary
An alternating current power capacitor including one or more capacitor bodies (e,g., bobbins) having conductive and dielectric film windings, wherein edges of the conductive film windings define a plane forming at least one capacitor body contact surface, οne or more electrodes having one or more electrode contact surfaces and a housing operative to apply compressive force that binds the capacitor body and electrode together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface.