Compressed air and lattice structure cooling
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Solution Overview
Problem
Existing cooling systems for electronic components in data centers, such as liquid cooling, are inefficient and prone to leakage, and traditional convection cooling methods are insufficient for high-power components, leading to performance degradation and premature component failure due to inadequate heat dissipation.
Innovation Solution
A compressed air and lattice structure cooling system that utilizes a heat conductive lattice structure with open-cell voids, a port to direct compressed air, and a base thermally coupled to the electronic component, along with a fractal spreader and vortex tube to enhance cooling efficiency, eliminating the need for fans and reducing weight and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used, then cooling efficiency is improved, but reliability deteriorates due to leakage
Solution Approach 1:
The patent replaces liquid cooling with compressed air cooling, using pneumatic principles to achieve heat dissipation without the leakage risks associated with liquid systems. Compressed air is delivered through a nozzle directly onto the electronic component, providing reliable cooling through gas-phase heat transfer rather than liquid-phase heat transfer.
Solution Approach 2:
The patent changes the physical state parameter of the cooling medium from liquid to compressed gas. By using compressed air at high pressure, the system achieves efficient heat transfer comparable to liquid cooling while eliminating the fundamental leakage problem inherent in liquid systems.
2Device complexity
If traditional convection cooling is used, then device complexity is reduced, but cooling efficiency deteriorates for high-power components
Solution Approach 1:
The patent applies preliminary action by pre-compressing the air before delivery to the electronic component. The compressed air delivers higher velocity and more effective heat transfer compared to ambient air convection, while the system remains relatively simple without requiring complex liquid cooling infrastructure.
Solution Approach 2:
The patent uses pneumatic cooling with compressed air delivered through a nozzle, combining the simplicity of air-based cooling with the enhanced efficiency of pressurized gas flow. This approach provides superior heat dissipation compared to natural convection while maintaining device simplicity.
3Temperature
If fans are used for cooling, then cooling capability is improved, but weight and device complexity increase
Solution Approach 1:
The patent uses a compressed air delivery system with a nozzle instead of mechanical fans. This pneumatic approach provides effective cooling capability while eliminating the heavy rotating components, bearings, and motor assemblies that constitute fan weight and complexity.
Solution Approach 2:
The patent extracts the cooling function from mechanical fan systems and implements it through a compressed air delivery mechanism. By removing the fan component entirely and using only a nozzle to direct compressed air, the system achieves cooling capability with significantly reduced weight and mechanical complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides more efficient heat dissipation, maintaining optimal operating temperatures for electronic components, reducing energy consumption, and extending component lifespan by delivering cooler air directly to components, thus improving overall data center performance.
Implementation Method 1
the vortex tube is configured to spin the compressed air to provide colder compressed air to an input of an assembly and exhaust warmer air
Implementation Method 2
the vortex tube is configured to spin the compressed air
Implementation Method 3
a heat conductive lattice structure through which an expansion of the compressed air is forced
Implementation Method 4
compressed air is forced through the heat conductive lattice structure to cool the electronic component
Implementation Method 5
compressed air is forced through the heat conductive lattice structure to cool the electronic component
Data Source
AI summary
Compressed air and lattice structure cooling is disclosed. In an embodiment, an assembly includes a heat conductive lattice structure with open-cell voids. The assembly also includes a port configured to provide compressed air that is directed toward the heat conductive lattice structure. The assembly also includes a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.