Compressed Solder Interconnects for Thin Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, and large package sizes.
Innovation Solution
The use of a compressed interconnection structure, such as a compressed solder ball, in an encapsulating process to form an aperture in the encapsulant, which is then reformed, allowing for a reduced thickness electronic device without the need for additional processes like ablation or multiple ball drops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then package reliability is maintained, but package size becomes too large and cost increases
Solution Approach 1:
The patent changes the physical state and dimensions of the interconnection structure by compressing solder balls into flattened configurations during encapsulation. This parameter change allows the interconnection structure to be embedded within the encapsulant thickness, reducing overall package size while maintaining electrical and mechanical functionality for reliability
Solution Approach 2:
The invention transitions the interconnection structure from a three-dimensional spherical form to a two-dimensional flattened configuration by applying compression during encapsulation. This dimensional change enables the interconnection structure to fit within the encapsulant thickness, reducing package volume while preserving connection integrity
2Manufacturing precision
If additional processes like ablation or multiple ball drops are used, then interconnection precision is improved, but processing time and complexity increase
Solution Approach 1:
The patent merges the encapsulation process with the interconnection structure formation by applying compression to solder balls during encapsulation. This combines what would traditionally be separate steps (encapsulation and interconnection formation) into a single integrated process, reducing processing time while achieving precise interconnection positioning
Solution Approach 2:
The invention performs preliminary compression of solder balls to flattened configurations before final encapsulation completes. This preliminary action prepares the interconnection structures in advance, allowing them to be properly positioned and formed during encapsulation without requiring subsequent ablation or additional ball drop operations
3Length of moving object
If package thickness is reduced, then device size is improved, but joint damage from warpage stress increases
Solution Approach 1:
The patent changes the geometric parameters of the interconnection structure by flattening solder balls during encapsulation. This creates a compressed interconnection configuration that is better distributed within the encapsulant, reducing stress concentration and preventing joint damage from warpage while enabling reduced device thickness
Solution Approach 2:
The encapsulant acts as an intermediary material that protects the compressed interconnection structures from warpage stress. The encapsulant encapsulates and supports the flattened interconnection structures, distributing mechanical stresses evenly and preventing joint damage while allowing thin package design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a semiconductor device with reduced thickness, lower processing time, and lower processing costs, while also preventing joint damage from package warpage stress.
Implementation Method 1
The compressed interconnection structure may then be reformed in the aperture
Data Source
AI summary
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.