Compressible Bonding Pad Structure for Height-Mismatch Assembly
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Solution Overview
Problem
In the bonding process of electronic devices, deviations in the thickness or position of bonding pads on both the substrate and electronic components can lead to poor bonding effects due to mismatched heights of bonding surfaces.
Innovation Solution
A manufacturing method involving the formation of compressible layers on either the substrate or the electronic components, along with bonding pads, allows for the adjustment of bonding surfaces to ensure proper contact and bonding through solid diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding pads are formed directly on substrate and electronic component without compressible layers, then manufacturing process is simple, but bonding quality deteriorates due to height mismatch
Solution Approach 1:
A compressible layer is introduced as an intermediary element between the bonding pad and the bonding surface. This compressible layer includes a compressible portion that can be compressed to adjust the height of the bonding surface, enabling precise height matching between substrate and electronic component bonding surfaces while maintaining a relatively simple overall structure.
2Reliability
If bonding surfaces are made at same height, then bonding effect is good, but manufacturing precision requirement becomes too strict
Solution Approach 1:
The compressible layer is designed with a compressible portion that can dynamically adjust its thickness through compression. During the bonding process, the compressible portion is compressed to raise the bonding surface to the required height, allowing the system to adapt to manufacturing variations without requiring extremely tight manufacturing tolerances for the bonding pads themselves.
Solution Approach 2:
The height of the bonding surface is adjusted by changing the compression state of the compressible layer. By controlling the compression amount, the bonding surface height can be precisely tuned to match the required level, compensating for variations in bonding pad thickness or position without requiring high manufacturing precision in the initial pad formation.
3Manufacturing precision
If compressible layer is added to adjust bonding surface height, then bonding quality improves, but device structure becomes more complex
Solution Approach 1:
The compressible layer is configured with different regions having different properties: a first portion and a second portion with different compressibility characteristics. This local differentiation allows precise control over the bonding surface height adjustment while keeping the overall structure relatively simple. The different portions can be tailored to specific local requirements without complicating the entire device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of compressible layers enables effective bonding even with deviations in bonding pad thickness or position, improving the bonding quality and increasing the qualification rate of electronic devices.
Implementation Method 1
a compressible range of the thickness of the compressible layer may be about 1% to about 10%
Implementation Method 2
forming a first compressible layer on the substrate
Implementation Method 3
bonding the electronic component with the substrate by contacting the second bonding pad with the first bonding pad
Data Source
AI summary
An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes following steps: providing a substrate; forming a first compressible layer on the substrate; forming a first bonding pad on the first compressible layer; providing an electronic component; forming a second bonding pad on the electronic component; and bonding the electronic component with the substrate by contacting the second bonding pad with the first bonding pad.