Compressible Bonding Layers for Bond Pad Height Mismatch
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Solution Overview
Problem
In the bonding process of electronic devices, deviations in the thickness or position of bonding pads on substrates and electronic components can lead to poor bonding effects due to mismatched heights of bonding surfaces.
Innovation Solution
A manufacturing method involving the formation of compressible layers on substrates and electronic components, with bonding pads formed on these layers, allowing for appropriate contact and solid diffusion bonding despite thickness or positional deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding pads are formed directly on substrates and electronic components without compressible layers, then the manufacturing process is simple, but the bonding surfaces may be at different heights due to thickness deviations, resulting in poor bonding effect
Solution Approach 1:
A compressible layer is introduced as an intermediary component between the bonding pad and the substrate/electronic component. This compressible layer acts as a mediator that absorbs height differences and enables contact between bonding surfaces at different elevations, resolving the contradiction between bonding precision and structural simplicity.
Solution Approach 2:
The compressible layer's key property is its ability to change its compression state. By utilizing the parameter change of compression, the layer can adapt to different bonding pad heights, allowing the bonding interface to accommodate thickness deviations while maintaining effective contact.
2Reliability
If compressible layers are added to compensate for thickness deviations, then the bonding effect is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The compressible layer serves as a mediator that bridges the gap between bonding pads with different heights. By placing this intermediary layer, the system achieves reliable bonding contact without requiring precise control of bonding pad thickness, thus improving bonding quality while adding a relatively simple manufacturing step.
Solution Approach 2:
The compressible layer is designed to be compressed during bonding to compensate for height differences in advance. This beforehand cushioning approach allows the bonding process to accommodate thickness variations without requiring real-time adjustment, improving bonding reliability while keeping the manufacturing process straightforward.
3Manufacturing precision
If bonding pads are made with uniform thickness, then the bonding surfaces align properly, but manufacturing deviations still cause height differences
Solution Approach 1:
Even when bonding pads are manufactured with uniform thickness, the compressible layer acts as an intermediary that ensures reliable contact. This intermediary provides an additional degree of freedom to accommodate any residual height differences, thereby enhancing bonding contact quality beyond what uniform thickness alone can achieve.
Solution Approach 2:
The compressible layer introduces a dynamic parameter (compression) that can adjust to compensate for thickness variations. This parameter change capability ensures that bonding contact quality is maintained even when bonding pads have uniform thickness but still exhibit minor height differences due to manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of compressible layers ensures consistent contact between bonding pads, improving the bonding effect and increasing the qualification rate of electronic devices by compensating for manufacturing-related deviations.
Implementation Method 1
forming a first compressible layer on the substrate; forming a second compressible layer on the electronic component
Implementation Method 2
The use of compressible layers ensures consistent contact between bonding pads, improving the bonding effect
Implementation Method 3
bonding the electronic component with the substrate by contacting the second bonding pad with the first bonding pad
Data Source
AI summary
An electronic device is provided by the present disclosure. The electronic device includes a substrate, an electronic component, and a bonding structure. The bonding structure is disposed between the electronic component and the substrate, and the bonding structure includes at least a first bonding layer and at least one compressible layer.