Compressible Fluid Cooling for Multi-Component Electronics Assemblies
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Solution Overview
Problem
Current cooling systems for electronics assemblies, such as those in infrared seekers, fail to effectively cool all components within the assembly, including heat-generating components like EOIR image processors and RF antennas, leading to temperature issues that can cause operational failures.
Innovation Solution
A thermal management system utilizing a reservoir with a compressible fluid in a compressed state, a throttling orifice for expansion, and a heat exchange volume to cool electronics components through convection and conduction, with an exhaust path to dissipate heat to the ambient environment, allowing for controlled temperature regulation and heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems (heatsinks, phase change materials, thermal electric coolers, cryogenic coolers) are used to cool isolated components, then those specific components can be cooled, but all other components in the electronics assembly remain uncooled and continue to overheat
Solution Approach 1:
The patent implements a universal cooling system that cools multiple different components simultaneously through a single integrated architecture. The common cooling structure includes a cooling fluid distribution system that delivers cooled fluid to multiple heat-generating components (infrared sensor, EOIR image processor, RF antenna, RF processors, Canard Actuation System electronics) through various heat exchange mechanisms, making one cooling system serve multiple functions and all components within the electronics assembly.
Solution Approach 2:
The cooling system is segmented into multiple independent cooling pathways that can be selectively activated. The system divides the cooling function into separate modules including a cooling fluid source, distribution manifolds, and individual heat exchange interfaces for different components. This segmentation allows the system to address thermal management needs of specific components while maintaining overall system cooling capability.
2Temperature
If cooling systems are added to cool all electronics components, then temperature control improves, but system complexity increases
Solution Approach 1:
The patent merges multiple cooling functions into a single integrated cooling system. Rather than implementing separate cooling mechanisms for each component (infrared sensor cooling, EOIR processor cooling, RF antenna cooling), the system combines these into one unified architecture that uses a common cooling fluid circulation system, shared heat exchange mechanisms, and centralized thermal management control, thereby reducing overall system complexity while maintaining comprehensive cooling coverage.
Solution Approach 2:
The cooling system incorporates passive thermal management features that reduce active control complexity. The design includes natural convection pathways, thermally conductive structures that automatically transfer heat from high-density electronics, and fluid distribution mechanisms that self-regulate based on thermal gradients, allowing the system to maintain cooling effectiveness without requiring complex active control systems for each component.
3Reliability
If multiple separate cooling systems are implemented for different components, then each component can be cooled, but the system becomes overly complex and difficult to maintain
Solution Approach 1:
The patent implements a universal cooling system that cools multiple different components simultaneously through a single integrated architecture. The common cooling structure includes a cooling fluid distribution system that delivers cooled fluid to multiple heat-generating components (infrared sensor, EOIR image processor, RF antenna, RF processors, Canard Actuation System electronics) through various heat exchange mechanisms, making one cooling system serve multiple functions and all components within the electronics assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains electronics components within a safe operating temperature range, preventing overheating and ensuring efficient operation, even in high-temperature environments and during high-acceleration events like gun launches.
Implementation Method 1
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid
Implementation Method 2
the cooled compressible fluid can be in fluid communication with the heat exchange volume to cool the heat exchange volume through convection
Implementation Method 3
the heat exchange volume can be in thermal communication with a heat generating electronics component of the electronics assembly to remove heat from the heat generating electrics component through conduction
Data Source
AI summary
In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.