Compressible Sliding Thermal Interface for Optical Module Heat Dissipation
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Solution Overview
Problem
Pluggable optical modules face inadequate heat dissipation due to insufficient clamping force and air-filled interstices between the riding heatsink and the module, leading to suboptimal thermal boundary resistance.
Innovation Solution
A compressible sliding thermal interface is integrated between the pluggable optical module and the riding heatsink, which is compressed to fill interstices and increase clamping force, enhancing thermal conductivity and reducing thermal boundary resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid thermal interface is used between the pluggable optical module and the riding heatsink, then thermal contact is established, but air-filled interstices remain and clamping force is insufficient, leading to high thermal boundary resistance
Solution Approach 1:
The patent changes the physical state and mechanical properties of the thermal interface material from rigid to compressible. The compressible material can deform under clamping force to eliminate air gaps and improve thermal contact between the module and heatsink, directly addressing the thermal boundary resistance issue while accommodating insufficient clamping force.
Solution Approach 2:
The patent employs a composite thermal interface solution combining compressible material properties with thermal conductivity requirements. The compressible sliding thermal interface material integrates both mechanical compliance (to fill interstices) and thermal conduction capabilities, creating a multi-functional interface that simultaneously addresses contact pressure and heat transfer needs.
2Quantity of substance
If the pluggable optical module is miniaturized to increase density in the cage, then more modules can be accommodated, but heat dissipation capacity is reduced due to insufficient clamping force
Solution Approach 1:
The compressible thermal interface material changes the mechanical interaction parameters between the module and heatsink. By allowing compression and deformation, the material ensures adequate thermal contact pressure even when modules are miniaturized and densely packed, maintaining heat dissipation capacity despite reduced individual module size and clamping force.
Solution Approach 2:
The compressible sliding thermal interface material acts as an intermediary element between the pluggable optical module and the riding heatsink. This intermediate layer compensates for the insufficient clamping force by deforming to create intimate thermal contact, thereby enabling effective heat dissipation from miniaturized modules that would otherwise have poor thermal coupling.
3Productivity
If increasing quantities of high-speed components are added to the pluggable optical module, then bandwidth is increased, but heat generation increases and heat dissipation becomes more difficult
Solution Approach 1:
The compressible thermal interface material serves as a mediator that improves the efficiency of heat energy transfer from the high-speed components to the heatsink. By ensuring intimate thermal contact through compression, the material facilitates more effective heat dissipation, allowing the system to handle the increased heat generation from higher bandwidth components.
Solution Approach 2:
The patent uses a composite thermal interface material that combines compressibility with high thermal conductivity. This composite structure allows the material to simultaneously manage the mechanical challenge of insufficient clamping force and the thermal challenge of increased heat generation from high-speed components, enabling improved bandwidth without proportional increase in heat dissipation difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation capacity by achieving a threshold thermal boundary resistance, reducing temperature by approximately 5-6°C for a 7 Watt DSP, and is durable, minimizing the need for frequent replacements.
Implementation Method 1
the compressible sliding thermal interface material is compressed by a threshold clamping force to fill interstices between a first surface of the substrate and a second surface of a riding heatsink
Implementation Method 2
the compressible sliding thermal interface protrudes from the first surface of the substrate such that insertion of the pluggable optical module into a cage that includes the riding heatsink compresses the compressible sliding thermal interface by the threshold clamping force to achieve a threshold thermal boundary resistance
Data Source
AI summary
A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.