Compressible Solder Adhesive for Consistent Semiconductor Package Height
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Solution Overview
Problem
Geometric variations in components of power device packages pose challenges in producing devices that conform to specifications, leading to difficulties in assembly and increased complexity in soldering processes.
Innovation Solution
The use of a compressible attachment material layer comprising elastomeric elements embedded within a matrix of solder material allows for elastic compression without damaging components, enabling consistent assembly heights and simplifying soldering jig design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional rigid attachment material is used, then manufacturing precision may be maintained, but geometric variations in components cause assembly difficulties and increased complexity
Solution Approach 1:
The attachment material's physical state is changed from rigid to compressible by incorporating elastomeric elements, allowing it to deform and accommodate geometric variations in components during assembly while maintaining consistent package height after compression
Solution Approach 2:
The attachment material is formulated as a composite consisting of solder matrix combined with elastomeric elements (such as rubber particles or foam structures), merging the bonding capability of solder with the compressibility of elastomers to simultaneously achieve ease of manufacture and manufacturing precision
2Strength
If rigid attachment material is used, then structural stability is achieved, but component damage may occur during assembly due to geometric variations
Solution Approach 1:
The elastomeric elements within the attachment material provide preemptive cushioning by deforming under compression to absorb geometric variations and misalignments before they can transmit damaging forces to the semiconductor components during assembly
Solution Approach 2:
The mechanical properties of the attachment material are modified to include compressibility while maintaining bonding strength, allowing the material to soften and adapt during assembly to prevent component damage, then maintain sufficient strength for reliable joints
3Manufacturing precision
If precise component dimensions are required, then manufacturing complexity increases, but geometric variations cause soldering process difficulties
Solution Approach 1:
The compressible attachment material performs self-adjustment during assembly by deforming to accommodate geometric variations in components, automatically compensating for dimensional tolerances without requiring complex soldering jigs or precision alignment procedures
Solution Approach 2:
The attachment material's compressibility parameter enables it to absorb dimensional variations, allowing the soldering process to proceed with standard components that have normal geometric tolerances rather than requiring precisely controlled component dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively accommodates minor variations in component dimensions, ensuring consistent package heights and reducing maintenance costs for soldering jigs, while maintaining the integrity of soldered joints.
Implementation Method 1
The compressible layer may comprise one or more elastomeric elements embedded within a matrix of solder material
Data Source
AI summary
A method of forming a semiconductor package includes providing a first metal substrate; and mounting a stacked arrangement on the first metal substrate, the stacked arrangement comprising a semiconductor die, wherein mounting the stacked arrangement includes: providing a first layer of attachment material between the first metal substrate and the stacked arrangement; and providing a second layer of attachment material within the stacked arrangement at an interface with the semiconductor die, wherein at least one of the first and second layers of attachment material is a compressible layer that includes one or more elastomeric elements embedded within a matrix of solder material.